EP3SL150F780C4LG

The EP3SL150F780C4LG is an Intel Stratix III family FPGA supplied in a 780‑ball FBGA package. It combines high-density logic, substantial on-chip memory, and a rich I/O complement for demanding digital signal processing, communications, and high-performance system designs.

Built on a 1.1‑V, 65‑nm all‑layer copper SRAM process and offering selectable core voltage and programmable power features, the device targets applications that require high logic density, embedded memory, and flexible I/O while operating within commercial temperature ranges.

Key Features

• High-density logic — Approximately 142,500 logic elements, enabling complex logic integration and large-scale custom logic implementations.
• Embedded memory — Approximately 6.54 Mbits of on-chip RAM (6,543,360 bits) for FIFOs, buffers, and user memory.
• Rich I/O — 488 user I/O pins to support multiple peripherals and high-pin-count system interfaces.
• Package and mounting — 780‑FBGA (29×29) / 780‑BBGA (FCBGA) package in a surface‑mount form factor for board‑level integration.
• Core supply — Operates with a core voltage range of 0.86 V to 1.15 V; supports selectable core voltage for power/performance tradeoffs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation.
• Programmable power and reliability — Family features include Programmable Power Technology, configuration CRC for error detection, and automatic error detection circuitry for CRAM and user memory.
• Security — Stratix III family support for optional 256‑bit AES encryption for configuration bitstream protection.
• DSP and arithmetic resources — Family DSP blocks that support 9×9, 12×12, 18×18, and 36×36 multipliers for multiply‑accumulate and FIR implementations.
• Clocking and PLLs — Up to 16 global clocks, 88 regional clocks, 116 peripheral clocks, and up to 12 PLLs for flexible clock management and synthesis.
• High-speed serial I/O — Family support for SERDES with dynamic phase alignment and 1.6 Gbps differential I/O capability for high-speed links.
• Standards and interfaces — Family-level support for a range of external memory interfaces and networking standards, enabling integration with DDR/DDR2/DDR3, RLDRAM II, QDR II/QDR II+, and common communications protocols.
• RoHS compliant — Conforms to RoHS requirements.

Typical Applications

• High-performance DSP and signal processing — Use the device’s DSP multipliers and large logic capacity for FIR filters, FFTs, and real‑time signal chains.
• Networking and communications — Leverage SERDES support, abundant I/O, and clocking resources to implement protocol processing and line‑rate interfaces.
• Memory controller and buffering — On‑chip RAM and memory-interface support suit high‑bandwidth buffering and controllers for external DDR/QLDRAM memory subsystems.
• Custom compute accelerators — Implement application‑specific compute blocks and offload tasks from processors using the device’s logic density and embedded resources.

Unique Advantages

• Large programmable fabric: Approximately 142,500 logic elements and sizeable embedded RAM enable integration of complex designs and reduce external component count.
• Flexible power/performance: Selectable core voltage and Programmable Power Technology let designers trade performance for lower power consumption where needed.
• Robust clocking and timing: Multiple global/regional/peripheral clocks plus up to 12 PLLs provide granular control over clock domains and timing requirements.
• Security and reliability features: Optional 256‑bit AES configuration encryption, CRC for configuration memory, and CRAM error detection improve design protection and availability.
• Broad interface support: Abundant I/O and SERDES capability support a wide range of external memory and high‑speed communications interfaces.
• Commercial-grade availability: Surface‑mount 780‑ball FCBGA package and RoHS compliance simplify assembly and regulatory alignment for mainstream products.

Why Choose EP3SL150F780C4LG?

EP3SL150F780C4LG brings Stratix III family architecture into designs that require high logic capacity, significant on-chip memory, and flexible I/O in a surface‑mount FBGA package. Its combination of programmable power features, built‑in security options, and robust clocking resources make it suitable for communication, DSP, and compute‑intensive applications within commercial temperature ranges.

This device is aimed at engineers looking to consolidate functions, accelerate processing, and maintain design flexibility while leveraging vendor‑supported IP and family-level capabilities for memory interfaces, DSP, and security.

Request a quote or submit an inquiry to purchase EP3SL150F780C4LG and discuss availability and pricing for your project needs.