EP3SL150F780C4N

The EP3SL150F780C4N is a Stratix III L field-programmable gate array (FPGA) offered in a 780‑FBGA (29×29) surface‑mount package. As a member of the Stratix III family, the device provides a high logic density fabric with on‑chip embedded memory and extensive I/O suitable for complex digital designs.

Typical use cases include high‑performance signal processing, high‑bandwidth interface implementations, and system designs requiring substantial embedded logic and memory resources while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity  Provides 142,500 logic elements for implementing large, complex digital designs and custom hardware functions.
• Embedded Memory  Approximately 6.54 Mbits of on‑chip RAM to support buffers, FIFOs, and memory‑intensive algorithms.
• I/O Resources  488 general-purpose I/O pins to support wide parallel interfaces and multiple differential/high‑speed links.
• Device Architecture  Stratix III family architecture (as documented in the device handbook) including dedicated DSP and clock network features referenced for the series.
• Package & Mounting  780‑BBGA FCBGA package (supplier device package: 780‑FBGA 29×29) designed for surface‑mount assembly.
• Power Supply  Core supply range of 860 mV to 1.15 V to match system power rails and regulator choices.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Signal Processing  Use embedded RAM and the Stratix III architecture to implement FIR/IIR filters, FFTs, and other DSP pipelines.
• High‑Bandwidth Communications  Large logic capacity and abundant I/O enable implementation of wide parallel interfaces and multi‑lane serial front ends.
• Memory Interface Controllers  On‑chip RAM and the family’s external memory interface capabilities support custom memory controllers and buffering strategies.
• Test & Measurement Systems  Flexible logic resources and plentiful I/O allow integration of acquisition, preprocessing, and protocol handling in a single device.

Unique Advantages

• High logic density: 142,500 logic elements provide headroom for complex state machines, datapaths, and hardware accelerators without immediate need for partitioning across multiple devices.
• Significant embedded memory: Approximately 6.54 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and temporary storage needs, simplifying board design.
• Extensive I/O count: 488 I/O pins support broad interfacing options—parallel buses, numerous peripherals, and multi‑channel front ends—minimizing external multiplexing.
• Compact BGA package: The 780‑FBGA (29×29) package enables a high‑density assembly suitable for space‑constrained PCBs while retaining robust connectivity.
• Commercial temperature and low-voltage core: Designed for 0 °C to 85 °C operation and a 0.86–1.15 V core supply to match common system power architectures.
• RoHS compliant: Meets lead‑free assembly and environmental compliance requirements for modern electronics manufacturing.

Why Choose EP3SL150F780C4N?

The EP3SL150F780C4N positions itself as a high‑capacity Stratix III L FPGA option for designs that require substantial logic resources, embedded memory, and a large I/O complement in a compact BGA package. Its documented Stratix III family features—such as embedded memory blocks, DSP capabilities, and advanced clocking—support complex digital signal processing and high‑bandwidth interface implementations within a commercial temperature range.

Choose this device when your design demands a single‑chip solution with large programmable logic and memory resources, a dense I/O fabric, and RoHS compliance—benefits that aid scalability, simplify board-level integration, and leverage the Stratix III device family documentation and support.

Request a quote or submit a product inquiry to get pricing, availability, and additional ordering information for EP3SL150F780C4N.