EP3SL200F1152I4G

The EP3SL200F1152I4G is an Intel Stratix III family FPGA offering high-density logic, substantial embedded memory, and broad I/O capability in a 1152-ball FCBGA package. It targets high-performance logic, digital signal processing (DSP), and embedded system applications that require scalable programmable logic with industrial temperature range and surface-mount packaging.

With 200,000 logic elements and approximately 10.9 Mbits of on-chip RAM, this device combines large fabric capacity with family-level features such as programmable power options, advanced I/O, and security/reliability mechanisms to support complex designs and system integration.

Key Features

• Core & Logic  200,000 logic elements deliver substantial programmable logic capacity for complex state machines, custom datapaths, and large-scale glue logic.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM provide high-capacity local storage for FIFOs, buffers, and embedded data structures.
• I/O Density & High-Speed Interfaces  744 user I/O pins in a modular bank structure enable wide external connectivity; Stratix III family features include dynamic on-chip termination and high-speed differential I/O with SERDES and dynamic phase alignment (family-level capability up to 1.6 Gbps).
• Clocking & PLLs  Stratix III family-level infrastructure provides extensive clocking resources—multiple global, regional, and peripheral clocks plus programmable PLLs—to support complex timing domains and clock synthesis.
• Power & Voltage  Operates with a core supply range of 0.860 V to 1.15 V and benefits from Stratix III programmable power technology and selectable core-voltage options described for the family to balance performance and power.
• Security & Reliability (Family Features)  Stratix III family options include 256-bit AES configuration encryption, CRC and ECC for configuration and memory integrity, and automatic error-detection circuitry to help maintain reliability in deployed systems.
• Package & Environmental  1152-ball FCBGA package (35 × 35 mm), surface-mount mounting, industrial grade with an operating temperature range of −40 °C to 100 °C, and RoHS compliant.

Typical Applications

• High-Performance DSP: Implement FIR filters, multipliers, and custom signal-processing pipelines using the device’s large logic capacity and embedded memory.
• Networking & Communications: Deploy protocol engines, interface bridging, and SERDES-supported links leveraging the device’s high I/O count and family-level high-speed I/O capabilities.
• Memory Controller & Interface Logic: Use the FPGA’s memory resources and I/O banks to implement DDR/DDR2/DDR3 and specialized memory interfaces described by the Stratix III family.
• Embedded System Integration: Integrate custom processors, peripheral controllers, and glue logic—benefitting from abundant logic elements, on-chip RAM, and family-level megafunction support.

Unique Advantages

• High Logic Capacity: 200,000 logic elements provide headroom for large designs and integration of multiple functions into a single device.
• Substantial On-Chip Memory: Approximately 10.9 Mbits of embedded RAM reduce external memory dependency and simplify board-level design for buffering and local storage.
• Broad I/O Connectivity: 744 user I/O pins in a modular bank arrangement enable flexible interfacing with external devices and memory systems.
• Industrial Temperature Range: Rated −40 °C to 100 °C for operation in demanding thermal environments.
• Power Versatility: Core supply operation between 0.860 V and 1.15 V supports selectable performance and power trade-offs when used with the family’s programmable power features.
• Design Assurance Features: Family-level support for AES configuration encryption, CRC, and ECC helps protect design IP and improve operational reliability.

Why Choose EP3SL200F1152I4G?

The EP3SL200F1152I4G positions itself for engineers who need a high-density FPGA with significant embedded memory and extensive I/O in a compact FCBGA package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 744 user I/O pins supports consolidation of complex logic, DSP, and interface functions into a single programmable device.

Backed by Stratix III family capabilities—programmable power options, robust clocking/PLL resources, high-speed I/O features, and security/reliability mechanisms—this device is suited to long-lived designs where scalability, integration, and operational robustness are priorities.

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