EP3SL200F1152I4N

The EP3SL200F1152I4N is a Stratix® III L field programmable gate array (FPGA) packaged in a 1152-ball FCBGA. It provides a high-density programmable fabric with 200,000 logic elements and approximately 10.9 Mbits of embedded memory for complex digital designs.

With 744 user I/O pins, a low-voltage supply range (0.86 V to 1.15 V), and industrial temperature grading (−40 °C to 100 °C), this device is targeted at designs that require broad I/O capability, substantial on-chip memory, and robust operation across extended temperature ranges.

Key Features

• Logic Capacity  200,000 logic elements provide substantial programmable resources for complex logic, control, and datapath implementations.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, lookup tables, and embedded storage without external memory in many designs.
• I/O Density  744 user I/O pins enable extensive interfacing to peripherals, serializers/deserializers, and multi-channel front ends.
• Power  Core voltage supply range from 0.86 V to 1.15 V to match low-voltage system architectures and power domains.
• Package & Mounting  1152-BBGA FCBGA package (1152-FBGA, 35×35) in a surface-mount format for compact, high-density board integration.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory Compliance  RoHS-compliant construction supports current environmental and manufacturing requirements.

Typical Applications

• High-density datapath acceleration  Use the large logic element count and embedded memory to implement custom datapath acceleration and parallel processing engines.
• Telecommunications and networking  High I/O capacity and on-chip RAM are suited for packet processing, protocol bridging, and multi-channel interface functions.
• Interface bridging and I/O aggregation  744 I/O pins allow the FPGA to consolidate multiple peripherals or act as a flexible interface hub between subsystems.
• Industrial control and automation  Industrial temperature rating and robust packaging make the device suitable for controllers and data handling in industrial environments.

Unique Advantages

• High programmable density: Large logic element count enables integration of complex functions on a single device, reducing part count and system complexity.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Extensive I/O resources: 744 I/O pins support wide parallel interfaces and multiple serial connections without additional multiplexing hardware.
• Compact BGA package: 1152-ball FCBGA footprint provides high pin count in a compact, surface-mount form factor for dense PCB designs.
• Industrial reliability: Rated for −40 °C to 100 °C operation, supporting deployment in extended-temperature applications.
• Environmentally compliant: RoHS compliance helps meet manufacturing and regulatory requirements.

Why Choose EP3SL200F1152I4N?

The EP3SL200F1152I4N combines a high logic element count, significant embedded memory, and an exceptionally large I/O complement in a compact FCBGA package—making it a practical choice for engineers building high-throughput, I/O-intensive, or memory-hungry FPGA designs. Its low-voltage core and industrial temperature rating align with power-conscious and rugged applications.

This device is suited to developers who need scalable programmable logic with strong on-chip resources and reliable operation across extended temperatures. The combination of integration and robustness helps reduce system BOM, simplify board-level design, and support long-term deployment in demanding environments.

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