EP3SL200F1152I4LN

The EP3SL200F1152I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package. It delivers high logic density and on-chip memory capacity suitable for designs that require extensive programmable logic, heavy I/O counts, and operation across an industrial temperature range.

Key device attributes include approximately 200,000 logic elements, roughly 10.9 Mbits of embedded memory, and 744 I/O pins, with a specified supply range of 860 mV to 1.15 V and operating temperatures from −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 200,000 logic elements provide large programmable fabric for complex digital designs and custom logic implementations.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM for buffering, packet processing, and memory-intensive logic functions.
• I/O Capacity  744 I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Power Supply  Specified core supply range from 860 mV to 1.15 V for compatibility with platform power architectures.
• Package and Mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type simplifies PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet temperature requirements for industrial applications.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density logic implementations  Implement large-scale custom logic, state machines, and algorithm acceleration using the device's extensive logic element count.
• Memory-intensive processing  Use the approximately 10.9 Mbits of embedded RAM for buffering, packet queues, or local data storage in streaming and real-time systems.
• I/O-heavy systems  Deploy in applications requiring many parallel interfaces or dense peripheral connectivity thanks to 744 I/O pins.
• Industrial embedded platforms  Integrate into industrial control and automation systems where extended temperature operation and surface-mount packaging are required.

Unique Advantages

• High logic density: Large logic-element count consolidates complex functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 10.9 Mbits of embedded RAM minimizes external memory dependency and improves data throughput.
• Extensive I/O capability: 744 I/O pins enable flexible interfacing to peripherals, sensors, and high-channel-count systems.
• Industrial-grade operation: −40 °C to 100 °C rating supports deployment in harsher environments common to industrial applications.
• Compact surface-mount BGA package: 1152-ball FCBGA (35×35) supports compact PCB designs while delivering high pin density.
• RoHS compliant: Facilitates regulatory compliance and end-product market acceptance.

Why Choose EP3SL200F1152I4LN?

The EP3SL200F1152I4LN positions itself as a high-density Stratix® III L FPGA option for designs that require a large number of logic elements, substantial embedded memory, and very high I/O counts within a single surface-mount BGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded platforms where reliability and regulatory alignment matter.

This device is appropriate for engineering teams building complex digital systems that prioritize integration and local memory resources, offering scalability and stability for longer-term deployments.

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