EP3SL200F1517C2G

The EP3SL200F1517C2G is a Stratix III family FPGA delivering a high-density, configurable logic platform for performance-focused embedded and digital signal processing applications. Built on a 65 nm, 1.1 V SRAM process with selectable core voltage support, this device combines large logic capacity, substantial embedded memory, and extensive I/O to support complex system integration and high-speed interfaces.

Targeted at commercial applications, the device is optimized for designs that require large logic resources, significant on-chip memory, and flexible I/O routing while operating within a 0 °C to 85 °C range and a core supply range of 0.860 V to 1.150 V.

Key Features

• Logic Capacity  Approximately 200,000 logic elements for implementing dense combinational and sequential logic, custom data paths, and state machines.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM (10,901,504 bits) for FIFOs, buffers, and storage of intermediate data.
• I/O and Package  Up to 976 user I/O pins in a 1517-FBGA (40×40) FCBGA package with surface-mount mounting for high-density board designs.
• Core Voltage Range  Configurable core supply from 0.860 V to 1.150 V to balance performance and power for different system needs.
• Clocking and PLLs  Rich clocking architecture with up to 16 global clocks, numerous regional and peripheral clocks, and support for up to 12 phase-locked loops for complex timing domains and clock synthesis.
• DSP and Arithmetic Support  Architecture includes high-speed DSP/multiplier resources suitable for dedicated multiply-accumulate and signal-processing functions.
• Memory Interface and Signal Integrity  Family features include dedicated memory interface support and dynamic on-chip termination and calibration for robust high-speed signaling.
• System Reliability and Security  Configuration CRC and optional AES-based configuration security and ECC protection for on-chip memory blocks as part of family-level features.
• Compliance  RoHS compliant and supplied in a commercial-grade package rated for 0 °C to 85 °C operation.

Typical Applications

• High-performance DSP systems  Implement FIR filters, matrix operations, and real-time signal processing using the device’s DSP resources and large logic fabric.
• Embedded compute and control  Integrate soft processors, custom accelerators, and control logic for communications equipment and industrial controllers within the commercial temperature range.
• Memory interface controllers  Use the device’s embedded memory and memory-interface support to implement DDR/DDR2/DDR3 or other high-speed memory front-ends and buffering.
• High-density I/O and protocol bridging  Leverage up to 976 I/Os and modular I/O bank structure to implement multi-protocol bridging, protocol aggregation, and complex interface routing.

Unique Advantages

• High logic density: The substantial logic element count enables complex logic consolidation and reduces the need for multiple devices on a board.
• Large on-chip memory: Approximately 10.9 Mbits of embedded RAM simplifies buffer and FIFO designs and reduces external memory dependence.
• Flexible I/O and package options: 976 user I/Os in a 1517-FBGA (40×40) package provide ample connectivity for high-pin-count designs while supporting surface-mount assembly.
• Configurable power/performance: Core voltage range from 0.860 V to 1.150 V enables design trade-offs between performance and power consumption.
• Robust clocking and PLL resources: Multiple clock domains and up to 12 PLLs support complex timing architectures and high-speed clock synthesis.
• Family-level reliability and security: Built-in CRC, ECC for memory blocks, and optional AES configuration security help protect configuration and system data.

Why Choose EP3SL200F1517C2G?

The EP3SL200F1517C2G balances high logic capacity, substantial embedded memory, and a wide complement of I/O in a commercial-grade Stratix III FPGA package. It is suited to engineers designing demanding DSP, embedded compute, and high-speed interface systems who need a programmable, high-density platform with flexible power and clocking options.

With family-level features for memory interface support, on-chip termination, configurable clocking, and security, this device offers a scalable foundation for systems that require integration of logic, memory, and high-speed I/O while maintaining design flexibility.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL200F1517C2G and to discuss how it fits your next design.