EP3SL200F1517C2N

The EP3SL200F1517C2N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a high-logic-capacity FPGA architecture in a 1517-BBGA FCBGA package for commercial-grade designs that demand dense logic resources and large on-chip memory.

With a wide I/O count and substantial embedded RAM, this device is intended for commercial applications that require high integration, flexible I/O connectivity, and reliable surface-mount packaging.

Key Features

• Core Logic 200,000 logic elements provide substantial capacity for complex digital designs and system integration.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, lookup tables, and temporary data storage.
• I/O Density 976 I/Os to support multiple interfaces and high pin-count system requirements.
• Power Supply Core voltage support from 0.86 V to 1.15 V to match system power-rail designs.
• Package & Mounting 1517-BBGA (FCBGA) / supplier device package 1517-FBGA (40×40); surface-mount package suitable for PCB assembly.
• Operating Conditions Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital systems — Implements large-scale combinational and sequential logic where 200,000 logic elements are required.
• I/O-intensive interfaces — Supports designs that need nearly 1,000 I/Os for parallel buses, multi-channel interfaces, or complex I/O routing.
• On-chip data buffering — Utilizes approximately 10.9 Mbits of embedded memory for buffering, packet storage, or lookup tables.

Unique Advantages

• High logic capacity: 200,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing external component count.
• Large embedded memory: Approximately 10.9 Mbits of on-chip RAM enables significant local data storage and reduces dependence on external memory.
• Extensive I/O: 976 I/Os provide the flexibility to connect numerous peripherals, sensors, or bus interfaces without additional bridge logic.
• Compact surface-mount package: 1517-BBGA FCBGA package supports high-density PCB layouts and automated assembly.
• Commercial temperature range: Rated 0 °C to 85 °C for use in standard commercial environments.
• RoHS compliant: Built to meet environmental manufacturing requirements.

Why Choose EP3SL200F1517C2N?

The EP3SL200F1517C2N positions itself as a high-capacity, commercially rated FPGA option from Intel, delivering a combination of dense logic resources, substantial on-chip memory, and very high I/O count in a single surface-mount package. It is well suited to designers who need to integrate complex digital functions and extensive interfacing into compact PCB assemblies.

For commercial design teams seeking scalability and integration at the board level, this device offers a practical balance of logic, memory, and I/O while meeting common environmental compliance standards.

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