EP3SL200F1517C4

The EP3SL200F1517C4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel offered in a 1517-BBGA FCBGA package. It delivers 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, and up to 976 user I/Os in a surface-mount form factor.

Designed for commercial-grade systems, this device operates with a core voltage range of 0.86 V to 1.15 V and an ambient temperature range of 0 °C to 85 °C, making it suitable for applications that require high logic density, substantial on‑chip memory, and large I/O counts.

Key Features

• Core Logic  200,000 logic elements provide significant combinational and sequential resources for complex digital designs.
• On-chip Memory  Approximately 10.9 Mbits of embedded RAM (10,901,504 bits) to support buffering, FIFOs, and state storage.
• High I/O Count  976 user I/Os enable broad parallel connectivity and multi-channel interfacing.
• Low-Voltage Core  Voltage supply range from 0.86 V to 1.15 V to match modern low-voltage system domains.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount format for compact system integration.
• Operating Range  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM for complex DSP algorithms and custom data processing pipelines.
• Multi-channel I/O and bridging  With 976 I/Os, the device is well suited for multiport interface bridging, parallel data aggregation, and protocol adaptation.
• Prototyping and system integration  The FCBGA package and extensive resources make the device appropriate for prototype platforms and high‑integration system designs.
• Buffering and packet handling  Embedded memory supports buffering and packet staging in data handling and communication tasks.

Unique Advantages

• High logic capacity: 200,000 logic elements enable implementation of large, complex designs without immediate migration to larger devices.
• Significant on-chip memory: Approximately 10.9 Mbits of RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O availability: 976 user I/Os allow dense peripheral connectivity and multi-channel interfaces directly to the FPGA.
• Low-voltage compatibility: Core voltage range of 0.86 V–1.15 V fits modern low-voltage system architectures.
• Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) surface-mount package supports high-density board layouts and reliable board-level mounting.
• RoHS compliant: Meets standard environmental compliance expectations for commercial products.

Why Choose EP3SL200F1517C4?

The EP3SL200F1517C4 delivers a balanced combination of high logic density, substantial embedded memory, and a very large I/O complement in a compact FCBGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of non‑automotive embedded applications where integration density and on‑chip resources drive design decisions.

This part is targeted at teams and projects that need significant programmable logic capacity and on‑chip RAM while maintaining a compact board footprint. Its voltage and temperature specifications, along with the package options, support scalable designs and straightforward integration into established development workflows.

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