EP3SL200F1517C4L

The EP3SL200F1517C4L is a Stratix® III L FPGA from Intel offering high logic capacity and extensive on-chip memory in a surface-mount FCBGA package. With 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 976 I/Os, it is designed for designs that require substantial programmable logic, large memory resources, and high I/O density while operating within commercial temperature and voltage ranges.

Key Features

• Core Logic  Delivers 200,000 logic elements to implement complex digital functions and high-density logic designs.
• Configurable Logic Blocks  Includes 8,000 CLBs to structure and organize programmable logic resources.
• On-Chip Memory  Approximately 10.9 Mbits of embedded RAM bits for buffering, look-up tables, and memory-intensive functions.
• I/O Capacity  976 general-purpose I/Os provide extensive connectivity for parallel interfaces, bus systems, and multi-channel signals.
• Power  Operates from a core voltage range of 0.86 V to 1.15 V to match system power domains and regulator designs.
• Package and Mounting  Supplied in a 1517-BBGA FCBGA surface-mount package (supplier package: 1517-FBGA, 40×40), optimized for high-pin-count board implementations.
• Commercial Grade and Thermal  Rated for commercial operation from 0 °C to 85 °C, suitable for standard-temperature electronic systems.
• Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many applications.

Typical Applications

• High-density logic implementations  Use the large logic element count to consolidate complex digital functions into a single FPGA for compact system designs.
• Memory-intensive processing  Leverage approximately 10.9 Mbits of embedded RAM for packet buffering, frame storage, and data staging close to logic.
• Multi-channel I/O interfacing  The 976 I/Os support wide parallel buses, multi-port bridging, and extensive peripheral integration without external multiplexing.
• Board-level integration  The 1517-BBGA surface-mount package enables high-pin-count integration on compact PCBs for space-constrained systems.

Unique Advantages

• High logic density: 200,000 logic elements allow integration of large digital subsystems into a single device, reducing component count.
• Substantial embedded memory: Approximately 10.9 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and storage tasks.
• Extensive I/O resources: 976 I/Os enable direct connections to numerous peripherals and parallel interfaces, simplifying board routing and design.
• Compact high-pin-count package: The 1517-BBGA FCBGA package supports dense PCB layouts while delivering the required I/O count.
• Commercial-grade operation: Rated 0 °C to 85 °C and RoHS compliant, suitable for standard commercial electronic products.
• Flexible power requirements: Core operation from 0.86 V to 1.15 V accommodates a range of system power architectures.

Why Choose EP3SL200F1517C4L?

The EP3SL200F1517C4L positions itself as a high-capacity Stratix® III L FPGA option for designs that demand significant programmable logic, ample embedded memory, and large I/O connectivity in a single, surface-mount package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of RAM, and 976 I/Os makes it well suited for consolidating complex digital subsystems and reducing external component count within commercial-temperature systems.

Manufactured by Intel and provided in a 1517-BBGA FCBGA package, this device delivers a balance of integration and board-level density for engineers focused on high-performance programmable designs requiring verified specifications for logic, memory, I/O, power, and temperature.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SL200F1517C4L and discuss how it can fit your next design.