EP3SL200F1517C4NAB

The EP3SL200F1517C4NAB is an Intel Stratix® III L field-programmable gate array (FPGA) optimized for mainstream, high-performance logic, DSP and embedded applications. Built on the Stratix III L architecture, the device combines a large logic fabric with substantial embedded memory and a high pin-count package to address complex system integration and signal-processing tasks.

This surface-mount FCBGA device is suited for commercial-temperature designs where high integration, flexible I/O, and selectable core-power tradeoffs are required.

Key Features

• Logic Capacity — 200,000 logic elements (equivalent) to implement complex combinational and sequential logic functions.
• Embedded Memory — Total on-chip RAM: 10,901,504 bits (approximately 10.9 Mbits) for buffering, FIFOs, and embedded data storage.
• I/O and Package — 976 user I/O pins in a 1517-BBGA (1517-FBGA 40×40) package; surface-mount mounting type for compact board integration.
• Power and Voltage — Selectable core voltage operation with a supply range of 860 mV to 1.15 V, enabling performance versus power tradeoffs.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family-Level Performance Features — Stratix III family capabilities include Programmable Power Technology, selectable core voltage, dedicated high-speed DSP blocks (supporting a range of multipliers), and dynamic on-chip termination for improved signal integrity.
• Clocking and PLLs — Device architecture supports rich clocking resources from the Stratix III family, including up to 16 global clocks and up to 12 phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• High-Speed I/O Support — Family-level support for high-speed differential I/O with SERDES and dynamic phase alignment; modular I/O bank structure for scalable external memory and interface designs.
• Security and Reliability — Stratix III family features include optional 256-bit AES configuration security, cyclic redundancy check (CRC) for configuration memory, and built-in ECC for on-chip memory blocks.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-Performance DSP — Implement FPGA-accelerated signal processing chains, FIR filters, and multiplier-intensive algorithms using the device’s DSP resources and substantial logic capacity.
• Embedded System Controllers — Combine processor interfaces, custom peripherals, and large local memory in a single FPGA for embedded control and data-path tasks.
• Networking and Communications — Use the device’s high-speed I/O, SERDES support, and flexible clocking for protocol bridging, packet processing, and interface adaptation.
• Memory Interface and Buffering — Leverage modular I/O and approximately 10.9 Mbits of embedded memory for DDR/DDR2/DDR3 or custom memory-controller implementations and large FIFO buffering.

Unique Advantages

• High integration density: 200,000 logic elements and approximately 10.9 Mbits of on-chip RAM reduce the need for external logic and memory, simplifying board-level BOM.
• Flexible power/performance tradeoffs: Selectable core voltage and Programmable Power Technology enable designers to optimize for either lower power or higher performance within the specified supply range.
• Rich clock and PLL resources: Multiple global and regional clocks plus up to 12 PLLs provide flexible, high-performance timing architectures for complex systems.
• Robust I/O and signal integrity: High pin count, modular I/O banks, dynamic on-chip termination, and high-speed I/O features support demanding interface and memory protocols.
• Security and reliability features: AES configuration options, CRC for configuration memory, and ECC for embedded memory enhance design robustness and protect IP.
• Commercial-temperature suitability: Designed for 0 °C to 85 °C operation for a wide range of commercial applications.

Why Choose EP3SL200F1517C4NAB?

The EP3SL200F1517C4NAB delivers a high-density Stratix III L FPGA platform that balances large logic capacity, substantial embedded memory, and flexible I/O in a compact FCBGA package. It is well suited for designers targeting high-performance logic, DSP, and embedded systems who require integrated memory, advanced clocking, and configurable power options within commercial-temperature applications.

Choosing this device provides scalability within the Stratix III family and access to family-level features such as Programmable Power Technology, security options, and advanced I/O capabilities—helpful for reducing board complexity and accelerating system integration.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EP3SL200F1517C4NAB.