EP3SL200F1517I3G

The EP3SL200F1517I3G is an Intel Stratix III family FPGA device — a high-density, high-performance programmable logic IC optimized for demanding logic, DSP and embedded designs. It combines a large number of logic elements and substantial on-chip memory with extensive I/O capability and family-level features focused on power efficiency, clocking flexibility, and system reliability.

Designed for industrial applications, this device targets use cases such as high-speed signal processing, memory interface controllers, and communication systems where high logic capacity, abundant I/O, and robust temperature range are required.

Key Features

• High logic density — 200,000 logic elements to implement complex digital designs and accelerate system integration.
• Embedded memory — approximately 10.9 Mbits of on-chip RAM for FIFOs, buffers and data storage close to logic.
• Extensive I/O — 976 user I/Os arranged to support wide external connectivity and modular I/O bank configurations.
• Package and mounting — 1517-BBGA (FCBGA) supplier package (1517-FBGA, 40×40), surface-mount for compact board integration.
• Industrial temperature range — rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Core voltage range and power control — nominal core supply from 860 mV to 1.15 V; Stratix III family features include selectable core voltage and Programmable Power Technology to balance performance and power.
• Advanced clocking and PLLs — family-level support for up to 16 global clocks, 88 regional clocks, 116 peripheral clocks and up to 12 PLLs for complex clocking architectures.
• DSP and multiplier support — family DSP blocks provide dedicated multipliers (9×9, 12×12, 18×18 and 36×36) suitable for high-throughput signal-processing tasks.
• High-speed I/O and SERDES — family support for high-speed differential I/O with SERDES and dynamic phase alignment enabling multi-gigabit signaling (family example: up to 1.6 Gbps SERDES performance).
• System reliability and security — family features include optional 256-bit AES encryption for configuration security, CRC for configuration memory error detection, and ECC for embedded memory blocks.
• Standards and memory interface support — family-level support for common high-speed external memory interfaces (DDR, DDR2, DDR3, RLDRAM II, QDR II, QDR II+) and dedicated DQS logic on I/O banks.
• RoHS compliant — meets RoHS environmental requirements.

Typical Applications

• High-performance DSP & signal processing — implement FIR filters, FFTs and other DSP kernels using the device’s dedicated multiplier blocks and large logic array.
• High-speed networking & communications — deploy protocol engines, SERDES interfaces and custom packet processing leveraging abundant I/O and high-speed differential support.
• Memory controller and interface bridging — build DDR/DDR2/DDR3 and QDR interface logic using on-chip memory and dedicated DQS support on I/O banks.
• Embedded systems and prototyping — integrate custom processors and peripheral logic (Nios II support is available at the family level) for rapid system development and IP integration.

Unique Advantages

• Scale of logic and memory: 200,000 logic elements and approximately 10.9 Mbits of embedded RAM enable large, tightly integrated designs without excessive external components.
• Flexible power/performance trade-offs: Selectable core voltage and programmable power features allow designers to tune for performance or energy efficiency within the specified 860 mV–1.15 V range.
• Robust industrial operation: The −40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in industrial environments.
• Comprehensive clocking and PLL resources: Multiple global/regional/peripheral clocks and up to 12 PLLs simplify complex timing architectures and multi-domain clocking.
• Security and reliability features: Family-level AES encryption, CRC configuration checks and ECC-protected memory blocks help protect and maintain system integrity.
• Broad memory and interface support: On-chip memory plus family support for common external memory standards reduce board-level complexity for memory-intensive applications.

Why Choose EP3SL200F1517I3G?

The EP3SL200F1517I3G delivers a compelling combination of high logic density, substantial embedded memory and extensive I/O in an industrial-grade Stratix III family device. Its family-provided capabilities — including advanced clocking, DSP blocks, high-speed I/O and security/reliability features — make it suitable for complex signal processing, high-throughput communication systems, and memory-centric designs that demand programmability and integration.

For teams building performance-focused, industrial-temperature systems, this device offers a scalable platform supported by Stratix III family architecture and megafunction ecosystems, enabling faster integration of IP and reduced overall system BOM.

Request a quote or submit a purchasing inquiry to evaluate EP3SL200F1517I3G for your next design.