EP3SL200F1517I3N

The EP3SL200F1517I3N is a Field Programmable Gate Array (FPGA) from the Stratix® III L family designed for high-density, programmable logic implementations. With 200,000 logic elements, approximately 10.9 Mbits of embedded memory and 976 I/O pins, it targets applications that require large on-chip memory, extensive I/O capability and significant logic capacity.

Packaged in a 1517-BBGA (FCBGA) 40×40 footprint and rated for industrial operation, this device supports designs that must operate across a wide temperature and voltage range while meeting RoHS compliance.

Key Features

• Core Logic 200,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM to support buffering, lookup tables and data storage within the FPGA fabric.
• I/O Capacity 976 user I/O pins deliver broad connectivity for sensors, interfaces and board-level integration.
• Power Core supply range of 860 mV to 1.15 V accommodates designs targeting low-voltage FPGA operation.
• Package & Mounting 1517-BBGA FCBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount format for compact board layouts.
• Temperature & Grade Industrial-grade operating range from -40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density FPGA designs — Use the large logic element count and embedded memory to implement complex custom logic, acceleration functions or protocol stacks.
• Multi-channel I/O systems — Leverage 976 I/O pins for high-pin-count interface aggregation, sensor arrays or board-level glue logic.
• Data buffering and packet handling — The substantial on-chip RAM supports buffering and temporary storage in streaming and packetized data paths.

Unique Advantages

• High logic density: 200,000 logic elements enable implementation of large, integrated digital systems on a single device, reducing external components.
• Significant embedded memory: Approximately 10.9 Mbits of on-chip RAM minimizes reliance on external memory for many designs, simplifying BOM and board layout.
• Extensive I/O availability: 976 I/O pins provide flexible connectivity options for parallel interfaces, multi-lane links or dense peripheral integration.
• Industrial-rated operation: -40 °C to 100 °C operating range supports deployment in industrial and temperature-stressed environments.
• Compact BGA packaging: 1517-BBGA (1517-FBGA, 40×40) surface-mount package enables high-density PCB integration while maintaining robust signal routing.
• RoHS compliant: Meets environmental manufacturing requirements for lead-free assembly processes.

Why Choose EP3SL200F1517I3N?

The EP3SL200F1517I3N combines a very large logic resource pool with substantial embedded memory and a near-1,000-pin I/O complement in a compact 1517-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require durability, high integration and environmental compliance.

This device is ideal for engineers and teams building high-density programmable logic solutions that demand high on-chip memory, broad connectivity and a compact footprint. Its specification set supports scalable designs where consolidation of logic and memory can reduce board complexity and overall system cost.

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