EP3SL200F1517C4N

The EP3SL200F1517C4N is a Stratix® III L FPGA in a 1517-FBGA (40×40) surface-mount package. It delivers a large programmable fabric with 200,000 logic elements and approximately 10.9 Mbits of embedded memory, designed for applications that require high logic density and substantial on-chip RAM.

With 976 available I/O pins and a core supply range of 860 mV to 1.15 V, this commercial-grade device targets designs that need extensive I/O connectivity and scalable logic resources within a compact FCBGA footprint operating from 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 200,000 logic elements for implementing complex digital functions and large-scale integration on a single device.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, lookup tables, and data path storage without relying on external memory.
• High I/O Count  976 I/O pins enable dense interfacing to peripherals, multi-channel signaling, and high-pin-count system connectivity.
• Package and Mounting  1517-BBGA (FCBGA) / 1517-FBGA (40×40) surface-mount package provides a compact, high-density footprint for board-level integration.
• Power  Core supply voltage range of 860 mV to 1.15 V accommodates power architectures designed for modern FPGA cores.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for standard temperature environments.
• RoHS Compliant  Manufactured to RoHS standards for lead-free assembly and regulatory compliance in typical commercial products.

Typical Applications

• High-density digital systems  Use the large logic element count to implement complex digital signal processing, protocol handling, or custom datapaths on a single FPGA.
• Multi-channel I/O platforms  Leverage 976 I/O pins to support high-channel-count interfaces, parallel buses, and dense peripheral connectivity.
• Embedded memory–intensive designs  Take advantage of approximately 10.9 Mbits of on-chip RAM for buffering, packet storage, and lookup tables that reduce external memory dependence.

Unique Advantages

• Large programmable fabric: 200,000 logic elements enable consolidation of multiple functions into a single device, simplifying board designs and reducing BOM.
• Substantial on-chip RAM: Approximately 10.9 Mbits of embedded memory supports local data storage needs and improves data-path efficiency.
• Extensive I/O connectivity: 976 I/Os allow flexible interfacing to numerous peripherals and parallel interfaces without intermediate multiplexing hardware.
• Compact high-density package: 1517-FBGA (40×40) packaging provides a space-efficient solution for high-pin-count FPGAs in surface-mount applications.
• Compliance and commercial readiness: RoHS compliance and a 0 °C to 85 °C operating range make the device suitable for standard commercial product deployments.

Why Choose EP3SL200F1517C4N?

The EP3SL200F1517C4N combines high logic capacity, significant embedded memory, and nearly 1,000 I/O pins in a compact 1517-FBGA package to address complex FPGA designs that demand integration and connectivity. Its commercial-grade operating range and RoHS compliance align it with standard product development and manufacturing processes.

This device is well suited for engineers and teams looking to consolidate multiple functions into a single FPGA, accelerate data-path implementation with on-chip RAM, and maintain board-level density without sacrificing I/O capability. The combination of resources supports scalable designs and long-term availability for commercial applications.

Request a quote or contact our sales team to discuss availability, lead times, and volume pricing for EP3SL200F1517C4N. Submit your requirements to receive a tailored quote and support for your design needs.