EP3SL200F1517I3

The EP3SL200F1517I3 is a Stratix® III L field programmable gate array (FPGA) from Intel, designed for high-density logic integration in demanding environments. It provides a large logic capacity, substantial embedded memory, and a very high I/O count in a 1517-BBGA (FCBGA) surface-mount package for industrial applications.

Key Features

• Core Logic  Approximately 200,000 logic elements to implement complex digital designs and large-scale HDL architectures.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM (10,901,504 bits) for data buffering, FIFOs, and local storage.
• I/O Density  976 I/O pins to support wide parallel interfaces, multichannel connectivity, and dense board-level routing.
• Power Supply  Core voltage range of 0.86 V to 1.15 V to match system power domains and optimize power/performance trade-offs.
• Package & Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for high pin count designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as industrial grade for deployment in harsher environments.
• RoHS Compliant  Designed to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Implement machine control, PLC logic, and sensor aggregation where high logic density and industrial temperature operation are required.
• Communications Infrastructure  Support high-channel routing and protocol handling with the large I/O count and significant on-chip memory for buffering and packet processing.
• High-performance Prototyping  Validate and prototype complex digital systems that demand substantial logic resources and flexibility in I/O assignment.
• Test & Measurement Systems  Enable real-time signal processing and data capture using abundant logic elements and embedded RAM for temporary storage and analysis.

Unique Advantages

• High Logic Capacity: 200,000 logic elements enable large, feature-rich FPGA designs without partitioning across multiple devices.
• Substantial On-chip Memory: Approximately 10.9 Mbits of embedded RAM reduce external memory dependency and improve data locality for lower-latency designs.
• Very High I/O Count: 976 I/O pins accommodate wide buses, many peripherals, and multi-channel interfaces on a single device.
• Industrial-rated Operation: Specified for −40 °C to 100 °C and listed as industrial grade for deployment in temperature-challenging environments.
• Compact, High-density Package: 1517-BBGA (1517-FBGA, 40×40 supplier package) provides a high pin count in a compact surface-mount footprint for space-constrained boards.
• RoHS Compliance: Meets environmental compliance requirements to support regulatory needs.

Why Choose EP3SL200F1517I3?

The EP3SL200F1517I3 combines large-scale programmable logic, significant embedded memory, and a very high I/O count in an industrial-rated FCBGA package, making it well suited for complex, I/O‑intensive systems that must operate across a wide temperature range. Its configuration supports dense integration and flexible system partitioning for industrial control, communications, prototyping, and measurement applications.

This device is a strong choice for engineers and procurement teams seeking a high-capacity Stratix® III L FPGA for scalable designs that demand robustness, extensive I/O, and on-chip memory resources.

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