EP3SL200F1517I3NAA
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 976 10901504 200000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 624 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 80000 | Number of Logic Elements/Cells | 200000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 10901504 |
Overview of EP3SL200F1517I3NAA – Stratix® III L Field Programmable Gate Array (FPGA)
The EP3SL200F1517I3NAA is a Stratix® III L family FPGA offering high-density, high-performance programmable logic targeted at demanding embedded, DSP and communications applications. Built on the Stratix III architecture, it provides a balanced mix of logic, on-chip memory and multiplier resources suitable for system integration where performance and configurability are required.
This device combines 200,000 logic elements with approximately 10.9 Mbits of embedded memory, a large I/O count and selectable core-voltage operation, making it appropriate for high-throughput signal processing, complex protocol handling and advanced interface implementations in industrial environments.
Key Features
- Logic Capacity 200,000 logic elements to implement complex state machines, control logic and custom datapaths.
- Embedded Memory Approximately 10.9 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
- I/O Density 976 user I/O pins enabling broad connectivity for parallel buses, high-speed interfaces and board-level integration.
- DSP and Multiplier Resources Family-level DSP blocks and multiplier support for high-performance multiply-accumulate operations and FIR filtering (as described for the Stratix III family).
- Power and Core Voltage Selectable core voltage operation with supply range from 860 mV to 1.15 V, supporting power-performance tradeoffs.
- Security and Reliability Family features include optional 256-bit AES encryption for configuration bitstream security and on-chip error detection for configuration memory.
- Package and Mounting 1517-BBGA (1517-FBGA, 40×40) surface-mount package for high-density board designs.
- Operating Range Industrial temperature grade with an operating range of −40 °C to 100 °C and RoHS-compliant construction.
Typical Applications
- High-Performance Signal Processing Implement multi-channel DSP engines, FIR filters and custom arithmetic pipelines using the device’s DSP resources and large logic fabric.
- Networking & Communications Support for high-speed I/O and modular bank structures enables implementation of protocol engines, packet processing and interface bridging.
- Memory Interface Controllers On-chip memory and I/O density support controllers and buffering for DDR/DDR2/DDR3 and other external memory interfaces as part of system designs.
- Embedded Systems Combine logic, memory and configurable I/O to implement custom embedded processing, peripheral aggregation and glue logic in industrial equipment.
Unique Advantages
- High Integration: Large logic element count and substantial embedded memory reduce external component count and simplify system architecture.
- Scalable Performance: Selectable core voltage and family-level power-management features enable designers to tune power versus speed for the target application.
- Robust I/O Capability: Nearly 1,000 user I/Os in a modular package allow flexible interface mapping and high pin-count connectivity on compact PCBs.
- Industrial Reliability: Industrial operating temperature rating and on-chip error detection features support deployment in temperature- and availability-sensitive environments.
- Configurable Security: Support for AES-based configuration encryption at the family level helps protect IP and system designs during configuration.
Why Choose EP3SL200F1517I3NAA?
The EP3SL200F1517I3NAA positions itself as a high-capacity, configurable platform for designs that require substantial logic, on-chip memory and extensive I/O in an industrial-temperature, surface-mount package. Its Stratix III L architecture combines balanced logic, memory and multiplier resources with selectable core-voltage operation to deliver a flexible solution for DSP-heavy and connectivity-centric systems.
For engineering teams building embedded signal processing, communications or advanced interface controllers, this device offers a scalable FPGA foundation with features focused on integration, configurable power/performance and deployment reliability.
Request a quote or submit a purchase inquiry to obtain pricing, availability and ordering information for EP3SL200F1517I3NAA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018