EP3SL200F1517I3NAA

The EP3SL200F1517I3NAA is a Stratix® III L family FPGA offering high-density, high-performance programmable logic targeted at demanding embedded, DSP and communications applications. Built on the Stratix III architecture, it provides a balanced mix of logic, on-chip memory and multiplier resources suitable for system integration where performance and configurability are required.

This device combines 200,000 logic elements with approximately 10.9 Mbits of embedded memory, a large I/O count and selectable core-voltage operation, making it appropriate for high-throughput signal processing, complex protocol handling and advanced interface implementations in industrial environments.

Key Features

• Logic Capacity 200,000 logic elements to implement complex state machines, control logic and custom datapaths.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
• I/O Density 976 user I/O pins enabling broad connectivity for parallel buses, high-speed interfaces and board-level integration.
• DSP and Multiplier Resources Family-level DSP blocks and multiplier support for high-performance multiply-accumulate operations and FIR filtering (as described for the Stratix III family).
• Power and Core Voltage Selectable core voltage operation with supply range from 860 mV to 1.15 V, supporting power-performance tradeoffs.
• Security and Reliability Family features include optional 256-bit AES encryption for configuration bitstream security and on-chip error detection for configuration memory.
• Package and Mounting 1517-BBGA (1517-FBGA, 40×40) surface-mount package for high-density board designs.
• Operating Range Industrial temperature grade with an operating range of −40 °C to 100 °C and RoHS-compliant construction.

Typical Applications

• High-Performance Signal Processing Implement multi-channel DSP engines, FIR filters and custom arithmetic pipelines using the device’s DSP resources and large logic fabric.
• Networking & Communications Support for high-speed I/O and modular bank structures enables implementation of protocol engines, packet processing and interface bridging.
• Memory Interface Controllers On-chip memory and I/O density support controllers and buffering for DDR/DDR2/DDR3 and other external memory interfaces as part of system designs.
• Embedded Systems Combine logic, memory and configurable I/O to implement custom embedded processing, peripheral aggregation and glue logic in industrial equipment.

Unique Advantages

• High Integration: Large logic element count and substantial embedded memory reduce external component count and simplify system architecture.
• Scalable Performance: Selectable core voltage and family-level power-management features enable designers to tune power versus speed for the target application.
• Robust I/O Capability: Nearly 1,000 user I/Os in a modular package allow flexible interface mapping and high pin-count connectivity on compact PCBs.
• Industrial Reliability: Industrial operating temperature rating and on-chip error detection features support deployment in temperature- and availability-sensitive environments.
• Configurable Security: Support for AES-based configuration encryption at the family level helps protect IP and system designs during configuration.

Why Choose EP3SL200F1517I3NAA?

The EP3SL200F1517I3NAA positions itself as a high-capacity, configurable platform for designs that require substantial logic, on-chip memory and extensive I/O in an industrial-temperature, surface-mount package. Its Stratix III L architecture combines balanced logic, memory and multiplier resources with selectable core-voltage operation to deliver a flexible solution for DSP-heavy and connectivity-centric systems.

For engineering teams building embedded signal processing, communications or advanced interface controllers, this device offers a scalable FPGA foundation with features focused on integration, configurable power/performance and deployment reliability.

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