EP3SL200F1517I4LG

The EP3SL200F1517I4LG is an Intel Stratix III family FPGA offered in a 1517-ball FCBGA package. It delivers high-density programmable logic with 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 976 user I/O pins, targeting demanding digital signal processing, networking, and high-performance embedded applications.

Designed for industrial environments, this device supports selectable core voltage operation (0.860–1.15 V) and an extended operating temperature range (−40 °C to 100 °C), combining performance, integration, and system-level reliability for complex designs.

Key Features

• High-density logic — 200,000 logic elements provide large programmable fabric for complex state machines, control logic, and custom processing implementations.
• On-chip memory — Approximately 10.9 Mbits of embedded RAM to implement buffers, FIFOs, and memory-mapped structures directly on device.
• Extensive I/O — 976 user I/O pins arranged to support wide parallel interfacing and multiple modular I/O banks for flexible board-level integration.
• Stratix III family capabilities — Family-level features include up to 16 global clocks, up to 12 PLLs for clock synthesis and dynamic phase control, and high-speed DSP blocks for multiply-accumulate and FIR implementations (as described in the Stratix III device handbook).
• High-speed memory and interface support — Family-level support for common high-speed external memory interfaces and networking standards, along with dedicated DQS logic on I/O banks for memory interfacing.
• Security and reliability — Family-level options include 256-bit AES configuration key support and on-chip CRC and ECC circuitry for configuration and memory error detection/correction.
• Power and voltage flexibility — Selectable core voltage operation between 0.860 V and 1.15 V enables designers to trade off power and performance according to system needs.
• Package and temperature — 1517-BBGA (1517-FBGA, 40×40) surface-mount package with industrial grade rating and operating temperature from −40 °C to 100 °C.
• RoHS compliant — Device meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-performance networking — Use the device’s large logic capacity and high pin-count I/O to implement packet processing, protocol offload, and custom network acceleration.
• Digital signal processing — Leverage Stratix III DSP block capabilities and abundant on-chip RAM for FIR filters, FFTs, and real-time signal chains.
• High-speed memory controllers — Use dedicated DQS support and family-level memory interface features to build controllers for DDR/DDR2/DDR3 and other external memories.
• Industrial automation and control — Industrial temperature range and robust packaging make the device suitable for motion control, motor drives, and factory communication gateways.
• Embedded system integration — Large logic density and multiple PLLs allow integration of processors, custom accelerators, and peripheral interfaces into a single programmable device.

Unique Advantages

• Large programmable fabric: 200,000 logic elements enable consolidation of multiple functions into one device, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces external memory requirements and improves latency for buffering and streaming tasks.
• Flexible I/O and clocking: 976 I/O pins plus multiple PLLs and global clocks simplify system timing and high-speed interface integration.
• Power configuration options: Selectable core voltage (0.860–1.15 V) lets designers optimize for power efficiency or maximum performance as needed.
• Industrial robustness: Surface-mount 1517-FBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.
• Built-in reliability and security features: Family-level CRC, ECC, and AES configuration options help protect designs and maintain system availability.

Why Choose EP3SL200F1517I4LG?

The EP3SL200F1517I4LG positions itself as a high-density Stratix III FPGA option for engineers needing ample logic resources, large embedded memory, and extensive I/O in an industrial-grade package. Its selectable core voltage and family-level timing, DSP, and security features allow designers to tailor power, performance, and reliability to application requirements.

This device suits complex embedded and signal-processing designs where integration, deterministic I/O, and operational robustness are priorities, delivering long-term value through scalable logic capacity and proven family-level capabilities.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SL200F1517I4LG. Provide your project details and quantity to receive a tailored response.