EP3SL200H780C2G

The EP3SL200H780C2G is a Stratix III–family Field Programmable Gate Array (FPGA) from Intel designed for high-performance logic, DSP and embedded system integration. It combines a large logic resource pool with substantial embedded memory and flexible I/O to support demanding data-path, communications and compute-centric applications.

This device targets commercial applications that require high logic density, multi-clock domain support and configurable on-chip resources. Key value propositions include selectable core voltage and programmable power features from the Stratix III architecture, together with integrated security and reliability features suitable for complex system designs.

Key Features

• Logic Capacity — Provides 200,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM for packet buffering, FIFOs and local data storage.
• I/O and Packaging — 488 user I/O pins in a 780-pin FCBGA/BBGA package (780-HBGA, 33×33) with surface-mount packaging to support modular board layouts.
• Core Voltage — Supports selectable core supply from 0.860 V to 1.15 V for performance/power trade-offs.
• Clocking and PLLs — Stratix III family clock architecture provides extensive clock resources and up to 12 PLLs for clock synthesis and distribution (family-level capability).
• High-speed I/O and SERDES — Family-level support for high-speed differential I/O, serializer/deserializer (SERDES) and dynamic phase alignment for high-throughput interfaces.
• Security and Reliability — Family features include optional 256-bit AES configuration bitstream security and configuration memory CRC and ECC for enhanced reliability (family-level features).
• Operating Range and Compliance — Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• High-performance DSP and Signal Processing — Dense logic and on-chip RAM enable implementation of filters, FFTs and other real-time DSP workloads.
• Networking and Communications — High-speed I/O, SERDES support and large logic capacity make the device suitable for protocol handling, packet processing and interface bridging.
• Memory Interface Controllers — Built to support external memory interfaces and on-chip DQS logic for DDR-family memory integration (family-level capability).
• Embedded Systems and Custom Logic — Ample logic, RAM and clock resources for integrating custom processors, peripherals and control logic in embedded designs.

Unique Advantages

• High logic density: 200,000 logic elements provide the headroom to implement large, integrated designs without immediate migration to a larger device.
• Substantial on-chip RAM: Approximately 10.9 Mbits of embedded memory reduces external memory dependence and improves throughput for buffering and local storage.
• Flexible power scaling: Selectable core voltage (0.860 V–1.15 V) enables designers to balance performance and power consumption at the board level.
• Robust I/O in a compact package: 488 user I/Os in a 780-pin surface-mount FCBGA offer a balance of pin count and board-area efficiency for complex I/O requirements.
• Security and on-chip reliability: Family-provided AES configuration security plus CRC/ECC for configuration and memory integrity support dependable operation in critical applications.
• Commercial-grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.

Why Choose EP3SL200H780C2G?

The EP3SL200H780C2G is positioned for designers who need a high-capacity, configurable platform from the Stratix III family that balances logic density, embedded memory and extensive I/O. Its selectable core voltage and family-level power-management features make it suitable for systems where performance and efficiency must be tuned.

With comprehensive family features such as PLLs, high-speed I/O capabilities, configuration security and on-chip reliability mechanisms, this device is appropriate for established FPGA-based designs in communications, DSP, memory interfacing and embedded processing. The Intel Stratix III ecosystem and supported megafunctions provide a pathway for scalable designs and long-term product support.

If you would like pricing, availability or technical support for the EP3SL200H780C2G, request a quote or submit an inquiry and our team will respond with the details you need to move your design forward.