EP3SL200H780C2

The EP3SL200H780C2 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, delivering a high-density programmable fabric with 200,000 logic elements and approximately 10.9 Mbits of embedded memory. Its combination of large logic capacity, extensive I/O and a compact 780‑ball BGA package targets designs that require substantial on-chip logic and memory resources within a commercial-temperature FPGA solution.

Key Features

• Core Logic  200,000 logic elements provide a large programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, state storage and memory-intensive logic functions.
• I/O Density  488 user I/O pins to accommodate a wide range of external interfaces and parallel connections.
• Power  Operates from a core voltage supply range of 860 mV to 1.15 V, enabling compatibility with modern low-voltage power domains.
• Package & Mounting  780-BBGA FCBGA (supplier package 780-HBGA, 33×33) in a surface-mount form factor for high-density board integration.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmental regulatory adherence.

Typical Applications

• FPGA-based system integration  Use the device where substantial on-chip logic (200,000 logic elements) and embedded memory are required to consolidate multiple functions into a single programmable device.
• High-density I/O control  With 488 I/Os, the FPGA suits applications that need extensive external signal routing, parallel interface support or board-level connectivity.
• Memory-intensive logic tasks  Approximately 10.9 Mbits of embedded RAM supports buffering, lookup tables and state machines in data-path and control applications.

Unique Advantages

• Large programmable capacity: 200,000 logic elements enable consolidation of complex logic blocks and reduce the need for multiple discrete ICs.
• Significant on‑chip memory: Approximately 10.9 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• Extensive I/O count: 488 I/O pins provide flexibility for parallel interfaces, bus connections and mixed-signal partitioning.
• Compact, high-density package: The 780-ball BGA FCBGA package in a surface-mount form factor supports compact PCBs and high routing density.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS compliant: Aligns with environmental regulations for lead‑free manufacturing.

Why Choose EP3SL200H780C2?

The EP3SL200H780C2 positions itself as a high-density Stratix® III L FPGA offering substantial logic and memory resources in a compact 780‑ball BGA package. It is suited to designers who need to implement complex, memory-rich logic with a large number of external connections while maintaining a commercial-temperature specification and surface-mount assembly.

Choosing this device provides a balance of integration and board-level flexibility: ample logic elements and embedded RAM reduce external components, a high I/O count enables broad system interfacing, and RoHS compliance supports modern manufacturing requirements.

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