EP3SL200H780C3G

The EP3SL200H780C3G is a high-density FPGA from Intel’s Stratix III family, designed for high-performance logic, digital signal processing and embedded applications. It combines a large logic fabric with substantial on-chip memory, flexible high-speed I/O and power-optimized architecture for demanding system designs.

Targeted at commercial-grade applications, this surface-mount FCBGA device delivers 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, and 488 user I/Os in a 780-ball HBGA 33×33 package, with an operating range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 200,000 logic elements to implement complex state machines, datapaths and custom logic functions.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM for FIFOs, buffers and embedded data storage.
• I/O and Packaging — 488 user I/Os in a 780-BBGA/FCBGA package (supplier device package: 780-HBGA 33×33); surface-mount mounting for board-level integration.
• Power and Core Voltage — Core supply range 0.86 V to 1.15 V with the Stratix III family’s Programmable Power Technology and selectable core voltage options to balance performance and power.
• High-speed DSP and Arithmetic — Dedicated DSP resources supporting 9×9, 12×12, 18×18 and 36×36 multipliers (up to 550 MHz) for signal processing and math-intensive algorithms.
• Clocking and PLLs — Up to 16 global clocks, numerous regional and peripheral clocks, and up to 12 phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• Memory Interface Support — On-package and on-die features to support high-speed external memory interfaces including DDR family options with dedicated DQS logic on I/O banks.
• High-speed SerDes and I/O Features — Support for high-speed differential I/O and SERDES with dynamic phase alignment for up to 1.6 Gbps signaling and dynamic on-chip termination.
• Security and Reliability — Family-level support for optional 256-bit AES encryption keys (volatile and non-volatile), CRC for configuration validation and ECC on memory blocks for enhanced data integrity.
• Compliance and Grade — Commercial grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

• High-performance DSP systems — Implement filters, FFT engines and real-time signal processing using dedicated multipliers and large on-chip memory.
• Network and communications — Build high-speed interfaces, protocol engines and SERDES-based links leveraging up to 1.6 Gbps I/O performance and modular I/O banks.
• Embedded compute and control — Integrate custom control logic, state machines and soft processors with the device’s large logic capacity and abundant clocks/PLLs.
• Memory interface controllers — Implement DDR/DDR2/DDR3 and specialized SRAM controllers using the device’s dedicated memory interface support and DQS logic.

Unique Advantages

• High integration density: 200,000 logic elements and ~10.9 Mbits of embedded RAM reduce external components and simplify board design.
• Flexible power/performance trade-offs: Selectable core voltage and Programmable Power Technology allow tuning for power-sensitive or performance-critical designs.
• Robust I/O and packaging: 488 user I/Os in a 780-ball HBGA package provide a compact platform for complex pinout and high-density board implementations.
• Built-in DSP capability: Dedicated multiplier blocks and high clocking resources accelerate signal processing and math-heavy workloads without adding external ASICs.
• Security and resiliency features: Optional AES encryption, CRC for configuration integrity and ECC in memory blocks support higher system reliability and IP protection.
• Broad interface support: Modular I/O banks and SERDES with dynamic termination make the device adaptable to a wide range of external memory and communications standards.

Why Choose EP3SL200H780C3G?

The EP3SL200H780C3G is positioned for designers who need a high-capacity, commercial-grade FPGA with a balance of logic, embedded memory and DSP resources. Its configurable power features, extensive clocking and PLL resources, and comprehensive I/O make it suitable for demanding logic, networking and signal-processing applications.

Backed by the Stratix III family architecture and ecosystem support for embedded processors and megafunctions, this device offers a scalable platform for projects that require significant on-chip integration, robust data integrity features and flexible performance tuning.

Request a quote or submit a pricing inquiry to evaluate EP3SL200H780C3G for your next design project.