EP3SL200H780C4

The EP3SL200H780C4 is an Intel Stratix® III L field-programmable gate array (FPGA) in a 780-ball BGA FCBGA package intended for commercial-grade systems. It provides a high-density programmable logic fabric with a large embedded memory pool and a substantial I/O count for complex, integrated digital designs.

Key architectural attributes include 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 488 user I/O pins, combined with a compact 780-HBGA (33×33) surface-mount package and a commercial operating temperature range.

Key Features

• Logic Capacity — 200,000 logic elements to support large-scale programmable designs and complex logic implementations.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM (10,901,504 total RAM bits) for datapath buffering, FIFOs, and state storage without immediate external memory.
• I/O Resources — 488 user I/O pins to interface with peripherals, high-speed transceivers, and multi-channel systems.
• Package and Mounting — 780-BBGA, FCBGA package in a 780-HBGA (33×33) supplier device package; surface-mount mounting type for high-density board integration.
• Power Supply — Core supply range from 860 mV to 1.15 V, enabling designs that target the specified core voltage window.
• Operating Temperature and Grade — Commercial grade with an operating range of 0 °C to 85 °C, suitable for standard commercial environment deployments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density logic implementations — Systems requiring large programmable fabrics can leverage 200,000 logic elements and extensive on-chip RAM to implement complex state machines and datapaths.
• I/O-intensive designs — Applications that need broad external interfacing can use the 488 available I/O pins for parallel buses, multiple peripheral connections, and board-level integration.
• Commercial embedded systems — Commercial-grade products operating within 0 °C to 85 °C can deploy this FPGA where RoHS compliance and surface-mount BGA packaging are required.

Unique Advantages

• High integration density: 200,000 logic elements combined with ~10.9 Mbits of embedded memory enable consolidation of logic and storage onto a single device.
• Extensive I/O count: 488 user I/O pins provide flexibility for multi-interface designs and complex board-level connectivity.
• Compact BGA packaging: The 780-HBGA (33×33) footprint supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial-ready thermal window: Rated for 0 °C to 85 °C operation, matching typical commercial system requirements.
• Regulatory alignment: RoHS compliance supports environmentally regulated product builds.

Why Choose EP3SL200H780C4?

The EP3SL200H780C4 positions itself as a high-capacity, commercially graded FPGA option for designers who need significant logic resources, substantial on-chip memory, and a high I/O count in a compact BGA package. Its combination of 200,000 logic elements and approximately 10.9 Mbits of embedded RAM enables integration of complex digital functions while the 780-HBGA package supports high-density PCB designs.

This device is suited to commercial embedded system designs that require programmable logic scalability, broad interfacing capability, and RoHS-compliant assembly. Its specified voltage and thermal ranges provide clear design parameters for power and thermal planning.

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