EP3SL200H780C4LN

The EP3SL200H780C4LN is an Intel Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 780-BBGA FCBGA package. It delivers high logic density and on-chip memory with a large I/O count for complex, board-level programmable logic designs.

With 200,000 logic elements, approximately 10.9 Mbits of embedded RAM and 488 I/Os, this commercial‑grade, surface‑mount device is targeted at applications that require significant integration density and broad interfacing capability. The device operates from a core supply range of 860 mV to 1.15 V and is specified for 0 °C to 85 °C operation. It is RoHS compliant.

Key Features

• Core Logic  200,000 logic elements to implement large-scale programmable designs and parallel processing architectures.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, FIFOs and scratchpad storage without immediate need for external memory.
• I/O Density  488 user I/Os to enable wide data buses and multiple peripheral interfaces on a single device.
• Power  Core voltage supply range of 860 mV to 1.15 V, suitable for modern low-voltage FPGA core operation.
• Package & Mounting  780-BBGA, FCBGA package (supplier package: 780-HBGA, 33×33) designed for surface-mount assembly and dense board layouts.
• Operating Range  Commercial temperature rating: 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital signal processing  Leverage the large logic fabric and embedded RAM for complex DSP algorithms and parallel data paths.
• Networking and communications equipment  Use the high I/O count and logic resources for packet processing, protocol bridging and custom interface logic.
• Prototyping and system validation  Implement and iterate large-scale FPGA designs on a commercially rated device with extensive on-chip resources.
• Board-level hardware acceleration  Offload compute-intensive tasks to programmable logic with ample logic and memory resources on-chip.

Unique Advantages

• Large programmable fabric: 200,000 logic elements provide headroom for complex logic, state machines and parallel implementations.
• Substantial on-chip RAM: Approximately 10.9 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage needs.
• Extensive I/O availability: 488 I/Os simplify integration with multiple peripherals and wide bus architectures without external multiplexing.
• Dense packaging: 780-BBGA (33×33 HBGA footprint) supports compact board layouts while remaining surface-mount friendly.
• Commercial-grade specification: Designed for 0 °C to 85 °C operation and RoHS compliance for standard industrial and commercial deployments.

Why Choose EP3SL200H780C4LN?

The EP3SL200H780C4LN positions itself as a high-density, commercially rated FPGA option within Intel’s Stratix III L family, offering a balance of large logic capacity, significant on-chip memory and a high I/O count for complex system designs. It is suited to engineers and procurement teams building solutions that require substantial programmable resources and robust board-level integration.

Documentation is available to support design integration and qualification for commercial applications, making this device a practical choice for projects that need scalable logic, embedded memory and broad interfacing in a single surface‑mount package.

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