EP3SL200H780I3N

The EP3SL200H780I3N is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel designed for high-density digital logic integration. It provides a large logic capacity and substantial on-chip memory, delivered in a 780-ball BGA (FCBGA) package for surface-mount applications.

Engineered for industrial use, this device combines 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 I/O pins to address demanding control, signal processing, and interface aggregation designs while operating across a wide supply voltage window and extended temperature range.

Key Features

• Core Architecture Stratix® III L FPGA architecture implemented in a high-density device suited for complex logic integration.
• Logic Capacity 200,000 logic elements to implement large-scale digital designs and custom accelerators.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• High I/O Count 488 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power Supply Range Operates over a core voltage range of 860 mV to 1.15 V to match system power designs.
• Package & Mounting 780-BBGA (FCBGA) surface-mount package, supplier device package 780-HBGA (33×33), for compact, high-pin-count board implementations.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• RoHS Compliant Environmentally compliant with RoHS requirements.

Typical Applications

• Industrial Control: Implement complex motor control, PLC logic, and sensor-fusion algorithms using the device’s high logic density and extended temperature rating.
• Communications Infrastructure: Use the abundant I/O and on-chip RAM for packet buffering, interface bridging, and protocol processing in network equipment.
• High-Density I/O Aggregation: Aggregate multiple parallel interfaces or implement wide data buses leveraging 488 I/O pins for board-level consolidation.
• Embedded Acceleration: Offload compute-intensive tasks to custom hardware implemented in the FPGA fabric, using ample logic elements and embedded memory.

Unique Advantages

• Substantial Logic Resources: 200,000 logic elements enable integration of large-scale digital systems on a single device, reducing external component count.
• Significant On-Chip RAM: Approximately 10.9 Mbits of embedded memory supports local buffering and low-latency data handling without immediate external memory.
• High Pin Count in Compact Package: 488 I/O in a 780-BBGA footprint allows dense connectivity while minimizing PCB area.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in harsh or outdoor industrial environments.
• Flexible Power Window: Core voltage support from 860 mV to 1.15 V enables integration with varied system power architectures.
• RoHS Compliance: Meets environmental requirements for lead-free assembly and regulatory preferences.

Why Choose EP3SL200H780I3N?

The EP3SL200H780I3N positions itself as a high-density, industrial-grade FPGA option for designs that require extensive logic, sizable on-chip memory, and a large number of I/Os in a single surface-mount package. Its combination of resources and temperature rating makes it well suited for industrial control, communications, and embedded acceleration applications where integration and reliability are priorities.

Backed by Intel as the manufacturer, this Stratix® III L device offers designers a route to consolidate functions, reduce BOM complexity, and maintain performance and thermal headroom across typical industrial environments.

Request a quote or submit a pricing inquiry today to evaluate the EP3SL200H780I3N for your next design.