EP3SL200H780I3

The EP3SL200H780I3 is a Stratix® III L Field Programmable Gate Array (FPGA) offering a high logic element count and substantial on-chip memory for complex digital designs. It combines 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 I/O pins in a surface-mount, 780-ball BGA package.

Specified for industrial operation, the device supports a core supply range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require dense logic, extensive memory, and robust temperature tolerance.

Key Features

• Logic Capacity — 200,000 logic elements to implement complex custom digital functions and large-scale FPGA designs.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM for buffering, FIFOs, and data storage within the FPGA fabric.
• I/O Density — 488 user-accessible I/O pins to support wide parallel interfaces and multiple external peripherals.
• Power — Core voltage supply range of 860 mV to 1.15 V to meet system power requirements.
• Package and Mounting — 780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33x33); surface-mount mounting type for board-level integration.
• Environmental & Temperature — Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Unique Advantages

• High logic density: 200,000 logic elements provide the capacity to integrate large, feature-rich digital subsystems on a single FPGA.
• Substantial embedded memory: Approximately 10.9 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Robust I/O count: 488 I/O pins enable broad connectivity for parallel buses, sensor interfaces, and multi-channel data paths.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C to support deployments in demanding thermal environments.
• Compact BGA package: 780-ball FCBGA construction supports high-density board designs while enabling surface-mount assembly.
• Regulatory compliance: RoHS-compliant construction supports environmentally conscious manufacturing requirements.

Why Choose EP3SL200H780I3?

The EP3SL200H780I3 positions itself as a high-capacity Stratix® III L FPGA targeted at designs that require substantial logic resources, significant embedded RAM, and extensive I/O connectivity in an industrial-grade, surface-mount BGA package. Its specified supply range and temperature ratings make it appropriate for engineers seeking a robust programmable device for dense digital implementations.

For development teams and procurement professionals looking to scale system complexity while keeping on-chip memory and I/O consolidation, this device provides verifiable specifications for logic, memory, power, and thermal operation that support long-term design planning and deployment.

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