EP3SL200H780C4G

The EP3SL200H780C4G is an Intel Stratix III family FPGA delivered in a 780-ball FCBGA package. It targets high-performance logic, digital signal processing and embedded designs that require substantial on-chip resources and configurable I/O.

Key on‑device resources include approximately 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 user I/O pins, combined with family-level architecture features designed to balance performance and power efficiency.

Key Features

• Core logic density – Approximately 200,000 logic elements provide substantial programmable fabric for complex logic, control and datapath implementations.
• Embedded memory – Total on-chip RAM of 10,901,504 bits (approximately 10.9 Mbits) to implement buffers, FIFOs and dual-port memories for data-centric functions.
• I/O and package – 488 user I/O pins in a 780-ball FCBGA (780‑HBGA, 33×33) package for high-density board integration and signal routing.
• Power and voltage – Core supply range from 860 mV to 1.15 V and family-level Programmable Power Technology and selectable core voltage to balance performance and power consumption.
• Performance engines – Stratix III family features include dedicated high-speed DSP blocks and SERDES with dynamic phase alignment for high-throughput signal processing and serial interfaces.
• Security and reliability – Family-level support for 256-bit AES encryption options, CRC configuration checking and on-chip ECC for embedded memory blocks to support secure and resilient systems.
• Operating and compliance – Commercial-grade device with operating temperature range 0 °C to 85 °C and RoHS compliance for standard electronics manufacturing.

Typical Applications

• High-performance signal processing – Use the device’s dense logic and dedicated DSP resources to implement FIR filters, FFTs and other compute-intensive signal chains.
• Communications and networking – SERDES and high-speed I/O support enable serial link and protocol implementations for networking and packet-processing functions.
• Memory interface controllers – Embedded memory and family memory interface support suit designs that require DDR/DDR2/DDR3-style external memory controllers and buffering.
• Embedded system prototypes – Large logic capacity and configurable I/O make the device suitable for prototyping complex custom logic and embedded processing subsystems.

Unique Advantages

• High integration of logic and memory – Approximately 200,000 logic elements combined with ~10.9 Mbits of embedded RAM reduce external component needs and simplify board design.
• Flexible I/O in a compact package – 488 user I/O in a 780-ball FCBGA (33×33) package provides a balance of pin count and board space for dense system designs.
• Configurable power-performance tradeoffs – Selectable core voltage and family-level programmable power features allow tuning for either higher performance or lower power consumption.
• Security and data integrity options – Family support for 256-bit AES encryption, CRC configuration checks and memory ECC enhances protection and system uptime.
• Commercial-grade availability – Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard electronics manufacturing requirements.

Why Choose EP3SL200H780C4G?

The EP3SL200H780C4G combines substantial on-chip logic and memory resources with configurable I/O and family-level Stratix III architectural features to support demanding logic, DSP and embedded applications. Its voltage range, package density and commercial operating temperature make it suitable for a wide range of high-performance electronic designs that require scalable programmable logic and integrated memory.

Designers and procurement teams can leverage the device’s integration and family-level capabilities to reduce BOM complexity, accelerate development of compute- and data-intensive functions, and maintain design flexibility across evolving project requirements.

Request a quote or submit a quote for EP3SL200H780C4G to receive pricing and availability information tailored to your project requirements.