EP3SL200H780C3N

The EP3SL200H780C3N is a Stratix® III L field programmable gate array (FPGA) in a 780‑ball FCBGA package designed for complex digital designs requiring high logic density, significant on‑chip memory and abundant I/O. With 200,000 logic elements, approximately 10.9 Mbits of embedded RAM and 488 I/O pins, this commercial‑grade FPGA targets systems that need large programmable logic capacity within a compact surface‑mount BGA footprint.

Key device attributes include a supply voltage range of 0.86 V to 1.15 V, RoHS compliance, and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of commercial electronic applications.

Key Features

• Core Logic  200,000 logic elements provide substantial programmable logic resources for complex implementations.
• Embedded Memory  Approximately 10.9 Mbits of on‑chip RAM to support buffering, state storage and data processing functions.
• I/O Capacity  488 user I/O pins enable broad connectivity options for parallel interfaces, peripheral integration and signal routing.
• Power  Operates from a supply voltage range of 0.86 V to 1.15 V to match system supply requirements for the core.
• Package  780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33 mm × 33 mm) in a surface‑mount format for compact board integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital processing  Implement complex, application‑specific logic and protocol handling using the device’s large logic element count and embedded memory.
• I/O‑rich interfacing  Use the 488 I/O pins to consolidate multiple peripheral and bus connections in a single FPGA solution.
• On‑chip buffering and data staging  Leverage approximately 10.9 Mbits of RAM for temporary data storage, FIFOs and packet buffering within data paths.

Unique Advantages

• High logic capacity: 200,000 logic elements enable implementation of large, integrated digital functions without external ASICs.
• Substantial embedded memory: Approximately 10.9 Mbits of RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count: 488 I/O pins provide flexibility for multi‑interface designs and parallel signal requirements.
• Compact FCBGA packaging: 780‑ball FCBGA (33 mm × 33 mm) offers high pin density in a surface‑mount form factor for space‑constrained boards.
• Commercial operating range: Rated 0 °C to 85 °C to match typical commercial electronic product environments.
• RoHS compliant: Conforms to RoHS environmental requirements for lead‑free assembly processes.

Why Choose EP3SL200H780C3N?

The EP3SL200H780C3N positions itself as a high‑capacity, commercial‑grade FPGA option for designers who need a combination of large logic resources, significant on‑chip RAM and a high I/O count in a compact BGA package. Its supply voltage range and surface‑mount FCBGA form factor make it suitable for tightly integrated boards where programmable logic must be dense and well connected.

Engineers and procurement teams designing complex digital systems, protocol bridges, or data buffering solutions will find the device’s resource balance and packaging advantageous for scalable designs that rely on long‑term availability and a compliant environmental profile.

Request a quote or submit a sales inquiry to obtain pricing, availability and further ordering information for the EP3SL200H780C3N.