EP3SL200H780C2N

The EP3SL200H780C2N is a Stratix® III L field programmable gate array (FPGA) IC from Intel designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count in a 780-ball BGA package, making it suitable for commercial designs that require significant logic capacity and interface density.

Key Features

• Logic Capacity  200,000 logic elements provide a large programmable fabric for complex digital designs and system integration.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM (10,901,504 bits) to support memory-intensive functions and local buffering.
• I/O Density  488 user I/Os enable extensive external interfacing and parallel signaling for multi-channel or high-bandwidth applications.
• Package and Mounting  Supplied in a 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mountable for PCB assembly.
• Powering  Core voltage supply range from 860 mV to 1.15 V to match low-voltage system domains.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS compliant, supporting environmentally regulated product designs.

Typical Applications

• High-density digital processing  Use the large logic capacity for complex state machines, datapath processing, and custom compute blocks.
• Memory-intensive algorithms  Leverage approximately 10.9 Mbits of embedded RAM for buffers, FIFOs, and local data storage in streaming or packet-based systems.
• High-I/O interface systems  The 488 I/O pins support multi-port connectivity, parallel sensor interfaces, and dense external device interconnects.
• Compact system integration  The 780-ball BGA surface-mount package enables integration into space-constrained PCBs while keeping BOM count low.

Unique Advantages

• Highly integrated logic and memory: 200,000 logic elements combined with ~10.9 Mbits of on-chip RAM reduce dependence on external memory and discrete logic.
• Extensive external connectivity: 488 I/Os simplify board-level routing for multi-channel and high-throughput designs.
• Compact BGA footprint: The 780-ball FCBGA/HBGA package provides a high pin-count solution in a compact 33×33 package outline for dense PCBs.
• Low-voltage core compatibility: Operates from 0.86 V to 1.15 V core supply domains, aligning with modern low-voltage system designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for standard commercial product environments.
• RoHS compliant: Enables designs that meet lead-free and restricted-substance requirements.

Why Choose EP3SL200H780C2N?

The EP3SL200H780C2N positions itself as a high-capacity Stratix® III L FPGA option for commercial applications that require substantial programmable logic, embedded memory, and a large number of I/Os in a compact surface-mount package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 488 I/Os makes it well suited to designs that consolidate functionality and minimize external components.

Engineers and procurement teams targeting scalable, integration-focused designs will find this device appropriate where commercial temperature operation and RoHS compliance are required. The 780-ball BGA package and low-voltage core range support modern PCB layouts and system power domains while enabling dense, feature-rich implementations.

Request a quote or submit an inquiry to obtain pricing and availability for the EP3SL200H780C2N and to discuss how it fits your next high-density FPGA design.