EP3SL200F1517I4LN

The EP3SL200F1517I4LN is a Stratix® III L field-programmable gate array offering large logic capacity and high I/O density in a surface-mount FCBGA package. It combines 200,000 logic elements with approximately 10.9 Mbits of embedded memory and 976 I/Os to support designs that require substantial on-chip logic and RAM resources.

Designed for industrial-grade operation with a supply range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, this device addresses applications that demand high integration, significant I/O count, and robust temperature performance.

Key Features

• Core Logic  Approximately 200,000 logic elements provide extensive programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM (10,901,504 bits) for buffering, storage, and data processing within the FPGA fabric.
• I/O Density  976 user I/Os enable high pin-count interfaces and extensive external connectivity options.
• Package  1517-ball BGA (1517-BBGA / 1517-FBGA, 40×40) in a flip-chip BGA surface-mount format for compact, high-density board integration.
• Power  Core supply range from 860 mV to 1.15 V to match system power-rail requirements and allow for predictable power planning.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in environments with wide thermal variation.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital systems  Use the large logic-element count and on-chip RAM to implement complex state machines, data paths, and control logic.
• High‑I/O interface hubs  Leverage 976 I/Os for designs that require multiple parallel interfaces, bus bridging, or extensive sensor/actuator connectivity.
• Data buffering and preprocessing  The substantial embedded memory supports on-chip buffering, temporary storage, and preprocessing tasks before external transfer.

Unique Advantages

• High programmable capacity: 200,000 logic elements enable large-scale logic integration without partitioning across multiple devices.
• Significant on-chip memory: Approximately 10.9 Mbits of RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O resources: 976 I/Os simplify board-level routing for high-channel-count designs and reduce the need for external interface chips.
• Industrial temperature operation: −40 °C to 100 °C rating supports deployment in environments with wide temperature swings.
• Compact BGA package: 1517-BBGA / 1517-FBGA (40×40) FCBGA enables high-density PCB layouts while maintaining a large I/O count.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP3SL200F1517I4LN?

The EP3SL200F1517I4LN positions itself as a high-capacity, industrial-grade FPGA suitable for designs that require substantial programmable logic, large embedded memory, and very high I/O counts within a compact BGA footprint. Its combination of 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 976 I/Os delivers a balanced platform for integrating complex digital functions while minimizing external components.

This device is appropriate for engineering teams and procurement groups focused on scalable, high-integration FPGA solutions that must meet industrial temperature requirements and RoHS compliance. Its specification set supports longer-term design stability and predictable system resource planning.

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