EP3SL200F1517I4L

The EP3SL200F1517I4L is a Stratix® III L field programmable gate array (FPGA) packaged in a 1517-ball FCBGA. It delivers a high logic capacity and substantial embedded memory in a surface-mount FCBGA footprint targeted for industrial applications. This device is suited for designs that require large logic resources, high I/O density, and operation across an industrial temperature range.

Key Features

• Core Logic  Provides 200,000 logic elements to implement complex digital logic and custom processing functions.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM for buffering, lookup tables, and data storage.
• I/O Density  976 user I/O pins enabling extensive peripheral and high-channel-count interfacing.
• Package  1517-BBGA (FCBGA) / supplier device package 1517-FBGA (40×40) for high-density board integration.
• Power  Supported core voltage range from 0.860 V to 1.15 V for core power planning and supply design.
• Mounting & Grade  Surface-mount device with industrial grade qualification and RoHS compliance.
• Operating Temperature  Rated for −40 °C to 100 °C to meet industrial temperature requirements.

Unique Advantages

• High logic capacity: 200,000 logic elements provide the headroom for large-scale digital designs and complex state machines.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces external memory needs and simplifies board-level BOM.
• Exceptional I/O count: 976 I/Os accommodate multi-channel interfaces and dense connectivity without additional multiplexing logic.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact, high-density packaging: 1517-ball FCBGA (40×40) balances board space efficiency with thermal and routing capabilities.
• RoHS compliant: Meets lead-free manufacturing requirements for regulated markets.

Why Choose EP3SL200F1517I4L?

The EP3SL200F1517I4L positions itself as a high-capacity, industrial-grade FPGA combining 200,000 logic elements, nearly 11 Mbits of embedded RAM, and 976 I/Os in a compact 1517-FBGA package. These characteristics make it well suited for engineers designing complex digital systems that require large programmable logic, significant on-chip memory, and dense external connectivity while operating across industrial temperature ranges.

Choose this device when your design priorities include integration of extensive logic and memory resources, high I/O density, and reliable operation in industrial environments—helping to reduce external component count and simplify system architecture.

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