EP3SL200F1517I4

The EP3SL200F1517I4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivering a large programmable fabric and significant on-chip memory capacity. Key device-level specifications include 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 976 I/Os.

Packaged in a 1517-BBGA FCBGA (supplier package: 1517-FBGA 40×40) for surface-mount assembly, the device is specified for industrial use with an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 860 mV to 1.15 V. The part is RoHS compliant.

Key Features

• Core Logic 200,000 logic elements provide substantial programmable logic capacity for complex, high-integration designs.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM to support memory-intensive logic functions and buffering.
• I/O Density 976 available I/Os to accommodate wide peripheral interfacing and high pin-count connectivity.
• Power Specified core supply range of 860 mV to 1.15 V to match system-level power architectures.
• Package & Mounting 1517-BBGA, FCBGA package (supplier: 1517-FBGA 40×40) in a surface-mount form factor for board-level integration.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance RoHS compliant for environmental requirement alignment.

Unique Advantages

• High logic density: 200,000 logic elements enable consolidation of complex functions onto a single FPGA, reducing the need for multiple devices.
• Substantial on-chip RAM: Approximately 10.9 Mbits of embedded memory supports large buffers, FIFOs, and state storage without external memory.
• Extensive I/O count: 976 I/Os provide flexibility for interfacing to a wide range of peripherals and parallel buses.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in industrial environments.
• Surface-mount BBGA packaging: 1517-BBGA FCBGA package (1517-FBGA 40×40) enables high-density board layouts and standard surface-mount assembly.
• RoHS compliant: Conforms to common environmental requirements for electronic assemblies.

Why Choose EP3SL200F1517I4?

The EP3SL200F1517I4 combines a large logic fabric, significant embedded memory, and a very high I/O count in an industrial-grade, surface-mount package. Its voltage and temperature specifications make it appropriate for robust designs that require high integration and predictable device-level behavior.

This device is suited to engineers and procurement teams seeking a high-capacity Stratix® III L FPGA offering clear, verifiable specifications for logic capacity, memory, I/O, package, and environmental ratings.

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