EP3SL200F1517I4N

The EP3SL200F1517I4N is a Stratix® III L field programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package. It provides a high degree of on-chip logic and memory integration for industrial applications.

With 200,000 logic elements, approximately 10.9 Mbits of embedded memory and up to 976 I/O pins, this device is positioned for designs that require dense logic capacity, substantial on-chip storage and broad external connectivity while operating across an industrial temperature range.

Key Features

• Core / Architecture  Stratix® III L FPGA architecture in a high-density device offering 200,000 logic elements for complex hardware implementations.
• Logic Array Blocks  8,000 logic array blocks provide a structured logic fabric to map combinational and sequential logic resources efficiently.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM for buffering, packet storage and local data processing without external memory.
• I/O Capacity  Up to 976 programmable I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power Supply  Core voltage range of 0.86 V to 1.15 V to match target system power architectures and core requirements.
• Package & Mounting  1517-BBGA (FCBGA) package with supplier device package listed as 1517-FBGA (40×40); surface-mount package suitable for compact PCB layouts.
• Temperature Range  Rated for operation from -40°C to 100°C, aligning with industrial temperature requirements.
• Regulatory  RoHS compliant for environmental and manufacturing process alignment.

Typical Applications

• Industrial Systems  Suited for industrial-grade designs that require operation across -40°C to 100°C and robust on-board logic and memory capacity.
• High-density I/O Systems  Ideal where large numbers of external interfaces are needed, leveraging up to 976 I/O pins for parallel and mixed-signal connectivity.
• Memory-intensive FPGA Designs  Useful for designs needing substantial on-chip buffering and storage with approximately 10.9 Mbits of embedded RAM.

Unique Advantages

• Highly integrated logic capacity: 200,000 logic elements enable consolidation of complex logic blocks on a single device, reducing external components.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM supports local data handling and reduces dependence on off-chip memory.
• Extensive I/O support: Up to 976 I/O pins facilitate high-connectivity designs and flexible interface mapping.
• Industrial temperature support: Rated from -40°C to 100°C for deployment in demanding thermal environments.
• Compact surface-mount package: 1517-BBGA FCBGA with a 40×40 supplier footprint enables dense PCB integration.
• Regulatory alignment: RoHS compliance supports environmentally responsible manufacturing and end-product compliance.

Why Choose EP3SL200F1517I4N?

The EP3SL200F1517I4N combines large-scale logic resources, significant embedded memory and a very high I/O count in a compact surface-mount BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust, long-life installations that demand sustained performance and environmental conformity.

This FPGA is appropriate for engineering teams and procurement seeking a high-density, high-connectivity programmable device that consolidates logic and memory on-chip, simplifying board-level designs and enabling scalable implementations within industrial product lines.

Request a quote or contact sales to submit your requirements and obtain pricing and availability for the EP3SL200F1517I4N.