EP3SL200H780C3

The EP3SL200H780C3 is a Stratix® III L field programmable gate array (FPGA) supplied in a 780-ball BGA package. It provides high logic density, substantial on-chip memory, and a large I/O count for complex, programmable digital designs in commercial-temperature environments.

With 200,000 logic elements and approximately 10.9 Mbits of embedded memory, this surface-mount FCBGA device is targeted at designs that require dense programmable logic, high I/O capacity, and controlled core-voltage operation.

Key Features

• Core Logic — 200,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM to support buffering, look-up tables, and localized storage.
• I/O Capacity — 488 general-purpose I/O pins to interface with multiple peripherals and external devices.
• Package & Mounting — 780‑BBGA, FCBGA package (supplier device package: 780‑HBGA, 33×33) in a surface-mount form factor for compact board integration.
• Power — Core voltage range 0.86 V to 1.15 V to match low-voltage system domains.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant component suitable for commercial product assemblies.

Typical Applications

• High-density digital systems — Implement complex logic functions and custom processing pipelines using the device's 200,000 logic elements.
• Memory-intensive buffering — Use approximately 10.9 Mbits of embedded RAM for data buffering, packet storage, or FIFO implementations.
• I/O-rich control systems — Connect multiple sensors, peripherals, and external interfaces leveraging 488 I/O pins.
• Compact board designs — Integrate high-capacity programmable logic in space-constrained PCBs using the 780‑BBGA surface-mount package.

Unique Advantages

• High logic capacity: 200,000 logic elements enable substantial on-chip implementation of complex digital designs without immediate external logic expansion.
• Significant embedded memory: Approximately 10.9 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O count: 488 I/O pins provide broad interfacing options for multi-device systems and dense peripheral connectivity.
• Compact FCBGA package: 780‑BBGA (780‑HBGA, 33×33) package offers a high-pin-count solution in a space-efficient, surface-mount footprint.
• Low-voltage core operation: 0.86–1.15 V core supply range supports integration with modern low-voltage power domains.
• Commercial-grade and RoHS‑compliant: Designed for commercial-temperature applications and compliant with RoHS requirements for lead-free assemblies.

Why Choose EP3SL200H780C3?

The EP3SL200H780C3 positions itself as a high-density programmable logic solution for commercial applications that require a combination of large logic resources, substantial embedded memory, and high I/O count in a compact BGA package. Its core voltage range and surface-mount 780‑BBGA footprint make it suitable for modern, space-constrained board designs.

This device is well suited to engineers and teams building complex digital systems that need integrated memory and extensive interfacing while adhering to commercial temperature and RoHS constraints.

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