EP3SL200H780C4L

The EP3SL200H780C4L is a Stratix® III L FPGA IC from Intel, presented in a 780-ball BGA FCBGA package. It delivers high logic capacity and substantial on-chip memory in a commercial-grade, surface-mount form factor suited to designs that need dense programmable logic and embedded RAM.

Key on-chip resources include 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 I/O pins. The device operates from 0 °C to 85 °C with a core supply range of 860 mV to 1.15 V, and is RoHS compliant.

Key Features

• Core Logic  200,000 logic elements provide a large fabric for implementing complex, high-density logic functions.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support data buffering, packet processing, and working memory without external RAM for many use cases.
• I/O Capacity  488 I/O pins available for wide bus interfaces, multiple peripheral connections, and flexible board-level routing.
• Power  Core supply voltage range of 860 mV to 1.15 V for compatibility with low-voltage FPGA power architectures.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), surface-mount mounting type for compact board layouts.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High-density logic designs  Use the device's 200,000 logic elements and large on-chip RAM to implement complex combinational and sequential logic in a single FPGA.
• Data buffering and packet handling  Approximately 10.9 Mbits of embedded memory supports temporary storage and buffering in data-path and network applications.
• Multi-interface systems  488 I/O pins enable integration with multiple peripherals, wide buses, and board-level interfaces in communication or embedded platforms.

Unique Advantages

• High logic density: 200,000 logic elements allow larger designs to be implemented without partitioning across multiple devices, simplifying system architecture.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and queueing needs, lowering BOM and board complexity.
• Extensive I/O: 488 I/Os provide design flexibility for multiple interfaces and parallel data paths, reducing the need for external I/O expanders.
• Compact package footprint: 780-ball BGA FCBGA (780-HBGA 33×33) surface-mount package supports dense board layouts while maintaining thermal and mechanical robustness.
• Commercial-grade reliability: Designed for operation across a 0 °C to 85 °C range, appropriate for mainstream commercial electronic products.
• RoHS compliance: Meets lead-free assembly requirements for regulated environments.

Why Choose EP3SL200H780C4L?

The EP3SL200H780C4L positions itself as a high-capacity programmable logic device that combines significant logic resources with ample embedded memory and broad I/O. Its commercial-grade temperature rating, standard core voltage range, and compact 780-ball BGA package make it suitable for designers targeting dense, integrated FPGA implementations with on-chip memory needs.

Engineers and procurement teams seeking a Stratix® III L FPGA with large logic and memory resources will find this device a practical choice for consolidating complex functions into a single package while maintaining compliance and a compact board footprint.

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