EP3SL200H780I3G

The EP3SL200H780I3G is an industrial-grade Stratix III family FPGA offering a high density of programmable logic and on-chip memory for demanding embedded, DSP and networking applications. Built on a configurable FPGA architecture, this device combines 200,000 logic elements with modular I/O and a broad clocking and PLL resource set drawn from the Stratix III family feature set.

Designed for systems that require high logic capacity, abundant I/O, and extended temperature operation, the device delivers flexible core-voltage operation and packaging options suitable for surface-mount board integration.

Key Features

• Logic Capacity — 200,000 logic elements to implement complex control, signal processing, and custom logic functions.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage.
• I/O and Bank Structure — 488 user I/O pins arranged for modular I/O bank implementation to support diverse interface standards and system partitioning.
• Clocking and PLLs — Stratix III family clock resources including multiple global and regional clocks and up to 12 PLLs for clock synthesis, switchover and dynamic phase adjustments.
• DSP and Arithmetic Support — Family DSP blocks for implementing multipliers and MAC functions suitable for FIR filters and other high-performance arithmetic tasks.
• Security and Reliability — Family-level support for optional 256-bit AES encryption and configuration memory CRC/ECC features for enhanced design security and error detection/correction.
• Power and Core Voltage — Device supports core operation across 0.860 V to 1.15 V, enabling flexible power/performance trade-offs consistent with Stratix III selectable core-voltage capability.
• Package and Mounting — Available in 780-ball FCBGA/HBGA package (780-HBGA, 33×33); surface-mount mounting for PCB integration.
• Temperature and Grade — Industrial grade operation from −40 °C to 100 °C, suitable for extended-temperature environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High‑performance signal processing — DSP blocks and large logic resources enable implementation of FIR filters, FFTs and custom signal chains for communications and instrumentation.
• Networking and communications — Modular I/O banks, SERDES-capable I/O within the family, and flexible clocking support packet processing, protocol bridging and high-speed interfaces.
• Embedded systems and custom SoC — Large logic element count and on-chip memory support integration of control logic, hardware accelerators and soft-core processors.
• Memory interface and buffering — Substantial embedded RAM and dedicated I/O features support external memory interfaces and high-throughput buffering for data-centric designs.

Unique Advantages

• High logic density: 200,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
• Significant embedded memory: Approximately 10.9 Mbits of on-chip RAM lowers dependency on external memory for mid-sized buffering and FIFO requirements.
• Flexible I/O and packaging: 488 user I/Os and a 780-ball FCBGA/HBGA package support dense, high-pin-count system integration while maintaining surface-mount assembly.
• Robust industrial operation: −40 °C to 100 °C operating range and industrial grade classification suit extended-temperature deployments.
• Configurable power/performance: Core voltage range of 0.860 V–1.15 V enables designers to tune power consumption versus performance.
• Family-level reliability and security: Stratix III family features such as configuration CRC/ECC and optional AES encryption add design robustness and security options.

Why Choose EP3SL200H780I3G?

The EP3SL200H780I3G delivers a balance of high logic capacity, substantial embedded memory and extensive I/O in an industrial-grade Stratix III FPGA package. Its combination of programmable resources, flexible core-voltage range, and family-level clocking, DSP and security features make it appropriate for system designs that require scalable performance and reliable operation across extended temperatures.

This device is well suited to engineers implementing complex digital signal processing, high-throughput communications, and integrated embedded systems who need a configurable, high-density FPGA platform with robust on-chip resources.

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