EP3SL200H780I4G

The EP3SL200H780I4G is an industrial-grade Stratix III family FPGA offering a high-density, high-performance programmable logic platform. It combines a large logic fabric with significant embedded memory and an architecture designed for demanding logic, DSP and embedded applications.

Built around the Stratix III family architecture, this device emphasizes performance and power efficiency with Programmable Power Technology and selectable core voltage, making it suitable for systems that require a balance of compute density, memory bandwidth and controlled power consumption.

Key Features

• Core and Architecture — Stratix III family technology with Programmable Power Technology and selectable core voltage; device core supply range 0.86 V to 1.15 V and fabricated on a 65-nm process (family-level detail).
• Logic Capacity — 200,000 logic elements for implementing complex custom logic and system functions.
• Embedded Memory — Approximately 10.9 Mbits of on-chip RAM to support FIFOs, buffering and local data storage.
• I/O and Bank Structure — 488 user I/Os in a modular I/O bank architecture (family supports modular I/O banks and a wide range of I/O standards), enabling flexible interface options.
• Clocking and Phase-Locked Loops — Family-level support includes multiple global and regional clocks and up to 12 PLLs for flexible clock management and synthesis.
• Security and Reliability — Family features include optional 256-bit AES configuration encryption and configuration memory error detection with CRC and ECC on embedded memory blocks.
• Package and Mounting — 780-BBGA (FCBGA) package; supplier device package specified as 780-HBGA (33×33); surface-mount mounting type.
• Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High-performance logic and DSP acceleration — Implement custom DSP pipelines, wide-bit arithmetic and high-throughput signal processing using the device’s large logic and memory resources.
• Networking and communications — Build protocol engines, packet processors and interface bridging where modular I/O banks and family-level high-speed I/O support are required.
• Memory interface controllers — Use on-chip memory and available DQS/DDR support at the family level to implement controllers and buffering for external memories.
• Embedded systems and IP integration — Integrate soft processors and vendor megafunctions (family-level support for Nios II and Megafunction IP) alongside custom logic for system-on-chip designs.

Unique Advantages

• High logic density: 200,000 logic elements enable implementation of large-scale digital designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• Flexible power management: Selectable core voltage and Programmable Power Technology allow tuning of performance versus power consumption.
• Industrial-grade operation: −40 °C to 100 °C rating supports deployment in industrial environments with extended temperature ranges.
• Robust system features: Family-level support for AES configuration encryption, CRC/ECC protections and multiple clock/PLL resources improves system reliability and security options.
• Package options for dense designs: 780-ball FCBGA/HBGA package (33×33) supports high I/O density in compact board layouts.

Why Choose EP3SL200H780I4G?

The EP3SL200H780I4G positions itself as a high-capacity, industrial-grade FPGA suitable for demanding logic, DSP and embedded applications. Its combination of 200,000 logic elements, around 10.9 Mbits of on-chip RAM, family-level reliability and security features, and selectable core voltage make it a practical choice for designs that require both compute density and controlled power behavior.

This device is well suited to engineers and systems designers building complex communication subsystems, memory interface controllers, real-time signal processing pipelines or integrated embedded systems leveraging available vendor IP. The Stratix III family-level features provide a clear upgrade and IP path for designs that need scalability and proven architectural capabilities.

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