EP3SL200H780I4LN

The EP3SL200H780I4LN is an Intel Stratix® III L FPGA delivering high logic density and substantial on-chip memory for complex, performance-oriented designs. It combines 200,000 logic elements with approximately 10.9 Mbits of embedded RAM and a 488-pin I/O count to support dense digital processing and wide I/O connectivity within a compact BGA package.

Specified for industrial-grade operation and surface-mount deployment, this device provides a balanced platform for designs that require large logic capacity, significant embedded memory, and robust environmental tolerance.

Key Features

• Core Density  200,000 logic elements provide a large fabric for implementing complex algorithms, parallel processing blocks, and high-function-count designs.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, data processing, and state storage without immediate reliance on external memory.
• I/O Capacity  488 user I/O pins enable broad connectivity to peripherals, buses, and external interfaces directly from the FPGA fabric.
• Package & Mounting  780-BBGA / FCBGA package (supplier package: 780-HBGA, 33×33) in a surface-mount form factor for high-density PCB implementations.
• Power  Core voltage supply range of 0.860 V to 1.15 V to accommodate system power designs within that envelope.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C, supporting deployment in demanding environmental conditions.

Unique Advantages

• High logic capacity: 200,000 logic elements enable implementation of large-scale logic, DSP, and control functions on a single device.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces external memory requirements and simplifies board-level design.
• Broad I/O connectivity: 488 I/Os allow direct interfacing to numerous peripherals and parallel data paths without extensive multiplexing.
• Industrial operating range: Rated from −40 °C to 100 °C to meet temperature demands of industrial applications.
• Compact BGA footprint: 780-ball BGA (33×33) surface-mount package supports dense PCB layouts while maintaining high pin count.
• Defined core voltage window: The 0.860 V to 1.15 V supply range clarifies system power planning for reliable operation.

Why Choose EP3SL200H780I4LN?

The EP3SL200H780I4LN positions itself as a high-capacity Stratix® III L FPGA option for engineers who need extensive logic resources, large embedded memory, and a high I/O count within an industrial temperature envelope. Its combination of 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 488 I/Os in a 780-BBGA package makes it suitable for designs requiring consolidated functionality and on-chip data handling.

This device is well suited to teams seeking a scalable FPGA platform that balances integration and environmental robustness while simplifying board-level design through substantial internal resources and a compact surface-mount BGA package.

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