EP3SL340F1517C2

The EP3SL340F1517C2 is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1517-ball FCBGA package. It delivers very large logic capacity and a high I/O count in a surface-mount, commercial-grade device.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 976 I/O pins, this device targets designs that require substantial on-chip resources and dense interfacing while operating within a 0 °C to 85 °C temperature range and a 0.86 V to 1.15 V core supply window.

Key Features

• Core Logic Capacity  337,500 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM supports buffering, lookup tables, and data manipulation without external memory.
• I/O Density  976 I/O pins enable high channel counts and dense connectivity for multi-channel systems and board-level integration.
• Package and Mounting  1517-FBGA (40×40) FCBGA package in a surface-mount form factor simplifies PCB layout for compact, high-density assemblies.
• Power Supply Range  Core voltage support from 0.86 V to 1.15 V accommodates the device’s specified operating conditions.
• Operating Temperature  Rated for commercial operation from 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS-compliant for environmental regulatory considerations in typical electronics manufacturing.

Typical Applications

• High-density digital processing  Large logic capacity and substantial on-chip RAM make the device suitable for intensive data-path and signal-processing implementations.
• Multi-channel I/O systems  A 976-pin I/O interface supports designs requiring many simultaneous external connections, such as data acquisition or complex control systems.
• Embedded system integration  The combination of logic, memory, and a compact FCBGA package supports integration in space-constrained embedded platforms.

Unique Advantages

• Extensive programmable resource pool: 337,500 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Significant on-chip memory: Approximately 18.8 Mbits of embedded RAM lowers dependence on external memory for buffering and state storage.
• High I/O count: 976 I/O pins enable direct interfacing to many peripherals and channels, minimizing additional bridging circuitry.
• Compact, manufacturable package: The 1517-FBGA (40×40) surface-mount package supports high-density PCB designs while maintaining standard assembly processes.
• Commercial-grade suitability: Specified 0 °C to 85 °C operating range fits mainstream commercial applications and development environments.
• RoHS compliance: Environmentally compliant construction for contemporary electronics manufacturing requirements.

Why Choose EP3SL340F1517C2?

The EP3SL340F1517C2 positions itself as a high-capacity, highly connected Stratix® III L FPGA option for commercial designs that demand large programmable logic, abundant on-chip RAM, and extensive I/O in a compact FCBGA package. Its resource levels make it suitable for consolidating complex digital designs and reducing external component count.

Engineers and procurement teams seeking a commercial-grade FPGA with verifiable specifications for logic elements, memory, I/O, package, voltage range, and operating temperature will find this device appropriate for scaling dense, feature-rich systems while adhering to standard manufacturing and environmental requirements.

Request a quote or submit your requirements to receive pricing and availability information for the EP3SL340F1517C2. Our team will respond with the details needed to move your design forward.