EP3SL340F1517C2G

IC FPGA 976 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,318 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13500Number of Logic Elements/Cells337500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18822144

Overview of EP3SL340F1517C2G – Field Programmable Gate Array (FPGA) IC

The EP3SL340F1517C2G is a Stratix III family FPGA offering a high-density, configurable logic platform for performance‑focused digital, signal processing, and embedded applications. Built for commercial-grade systems, this surface-mount FCBGA device delivers a large logic capacity, substantial on-chip memory, and flexible I/O to support complex system integration and high-throughput designs.

Key Features

  • High Logic Capacity — 337,500 logic elements to implement large-scale digital designs and complex control or processing functions.
  • Embedded Memory — Approximately 18.8 Mbits of on-chip RAM, suitable for buffering, FIFOs, and memory‑centric functions.
  • Extensive I/O — 976 user I/O pins provided in a modular I/O architecture, enabling multiple parallel interfaces and dense external connectivity.
  • Clocking and PLLs — Family support for multiple global and regional clocks and up to 12 PLLs per device for flexible clock management and synthesis.
  • DSP and Multipliers (Family Feature) — Stratix III family includes high-speed DSP blocks and dedicated multipliers for efficient implementation of signal processing and numeric workloads.
  • Power and Core Voltage — Operates with a core voltage range from 860 mV to 1.15 V; family-level Programmable Power Technology and selectable core voltage mechanisms support power/performance tradeoffs.
  • Package and Mounting — 1517-BBGA FCBGA package (1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
  • Commercial Temperature Range — Rated for 0 °C to 85 °C operation and RoHS compliant for applicable environmental requirements.

Typical Applications

  • High-Performance DSP — Implement FIR filters, FFTs, and other signal-processing pipelines using the family’s dedicated DSP blocks and abundant logic elements.
  • Communications & Networking — Support multi‑lane and high‑throughput interfaces through extensive I/O resources and flexible clocking/PLL options.
  • Memory Interface & Buffering — Large embedded memory and configurable logic enable memory controllers, buffering, and packet processing tasks.
  • Embedded Systems & Custom Logic — Host custom state machines, protocol handling, or accelerator functions that benefit from high logic density and on-chip RAM.

Unique Advantages

  • Large, Scalable Logic Resource: 337,500 logic elements provide headroom for complex SoC‑class implementations and iterative design growth.
  • Significant On‑Chip Memory: Approximately 18.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • High I/O Count for Integration: 976 user I/O pins allow integration of multiple external interfaces without complex multiplexing or external glue logic.
  • Flexible Clocking: Multiple clock regions and support for numerous PLLs help simplify clock domain management and high-speed interface timing.
  • Commercial‑Grade and RoHS Compliant: Designed for mainstream commercial deployments with surface-mount packaging and environmental compliance.
  • Compact FCBGA Package: 1517‑FBGA (40×40) package delivers high density in a board‑level friendly footprint.

Why Choose EP3SL340F1517C2G?

The EP3SL340F1517C2G pairs comprehensive logic capacity and significant embedded memory with a high I/O count and flexible power/clocking options drawn from the Stratix III family. It is suited for designs that require large programmable logic resources, on‑chip buffering, and dense external connectivity within a commercial temperature envelope.

This device is a practical choice for engineering teams building high‑performance DSP engines, protocol processors, memory interface controllers, or custom accelerators that benefit from an FPGA platform with mature family features and integration flexibility.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL340F1517C2G.

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