EP3SL340F1517C3

The EP3SL340F1517C3 is an Intel Stratix® III L field programmable gate array (FPGA) packaged in a 1517-BBGA FCBGA (supplier package 1517-FBGA, 40×40) with surface-mount mounting. It provides a large logic fabric and substantial embedded memory alongside a high I/O count for designs that require dense integration of programmable logic and on-chip resources.

With a supply range of 860 mV to 1.15 V and a commercial operating temperature range of 0°C to 85°C, this device addresses commercial-grade applications that need significant logic capacity, embedded RAM, and extensive connectivity in a compact package.

Key Features

• Core Logic Capacity — 337,500 logic elements to implement complex digital logic and parallel processing functions on a single device.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM (18,822,144 bits) to support buffering, FIFOs, and local data storage without immediate reliance on external memory.
• High I/O Count — 976 user I/Os to accommodate dense external interfacing and multiple peripheral connections.
• Power — Operates from 860 mV to 1.15 V supply rails for integration into low-voltage system domains.
• Package & Mounting — 1517-BBGA, FCBGA (supplier package 1517-FBGA, 40×40); surface-mount package suitable for compact PCB implementations.
• Temperature & Grade — Commercial grade with an operating range of 0°C to 85°C for standard commercial deployments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Data center and networking equipment — Large logic capacity and 976 I/Os support packet processing, protocol bridging, and interface-rich networking functions.
• High-performance compute and acceleration — Extensive logic elements and on-chip RAM enable implementation of compute kernels and custom accelerators within commercial systems.
• Video and signal processing — Substantial embedded memory combined with dense logic resources supports buffering, pipelines, and real-time signal algorithms.
• Test, measurement, and instrumentation — High I/O count and on-chip resources provide flexible front-end interfacing and data handling for commercial lab equipment.

Unique Advantages

• Highly integrated logic capacity: 337,500 logic elements reduce the need for multiple discrete programmable devices in high-density designs.
• Significant on-chip memory: Approximately 18.8 Mbits of embedded RAM lowers external memory dependency for many buffering and storage tasks.
• Extensive connectivity: 976 I/Os simplify system-level integration by supporting numerous external interfaces and peripherals.
• Compact FCBGA packaging: 1517-FBGA (40×40) surface-mount package provides a dense form factor for space-constrained PCBs.
• Commercial temperature qualification: Rated 0°C to 85°C for standard commercial deployments where consistent performance across that range is required.
• RoHS compliant: Environmentally compliant for markets that require restricted substance adherence.

Why Choose EP3SL340F1517C3?

The EP3SL340F1517C3 combines very large logic resources, substantial embedded memory, and nearly one thousand I/Os in a single Stratix® III L FPGA package, making it well suited for commercial designs that demand high integration and flexible I/O. Its low-voltage supply range and compact FCBGA package enable designers to implement dense, capable systems without distributing functions across multiple devices.

This device is aimed at system designers and procurement teams building commercial-grade networking, compute acceleration, signal processing, or instrumentation products that require significant programmable logic and on-chip RAM in a compact, RoHS-compliant package from Intel.

Request a quote or submit a procurement inquiry for EP3SL340F1517C3 to receive pricing and availability information.