EP3SL340F1517C2N

The EP3SL340F1517C2N is a Stratix® III L field programmable gate array (FPGA) IC from Intel, delivered in a 1517-BBGA / 1517-FBGA (40×40) surface-mount package for commercial applications. It provides a high logic element count, substantial on-chip RAM, and a large number of I/O pins, making it suitable for designs that require dense logic integration, abundant embedded memory, and extensive I/O connectivity.

Key Features

• Core Logic  337,500 logic elements deliver significant programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions.
• I/O Capacity  976 user I/O pins provide wide external connectivity for high-channel-count interfaces and parallel subsystems.
• Package & Mounting  Available in a 1517-BBGA, FCBGA form factor; supplier device package listed as 1517-FBGA (40×40). Surface mount package supports modern PCB assembly processes.
• Power  Core voltage supply range from 0.860 V to 1.15 V to match system power-rail requirements and optimize power delivery.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-density digital systems  Use the large logic element count and abundant I/O to implement complex state machines, protocol bridges, and dense glue-logic.
• Memory-centric designs  Leverage approximately 18.8 Mbits of embedded RAM for buffering, packet queues, or on-chip data staging.
• I/O-intensive subsystems  Support multi-channel data acquisition, parallel buses, or multiport interfaces with the device’s 976 I/O pins.
• Prototype and system integration  Commercial-grade temperature range and surface-mount packaging make it suitable for development and integration into production electronic systems.

Unique Advantages

• High logic density: 337,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip RAM: Approximately 18.8 Mbits of embedded memory support data-intensive tasks without immediate need for external memory.
• Extensive I/O: 976 I/O pins provide flexibility to interface with numerous peripherals and parallel channels directly.
• Compact, surface-mount package: The 1517-FBGA (40×40) package balances high pin-count with a compact PCB footprint for dense system designs.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation for general-purpose electronic products and RoHS-compliant for regulatory alignment.

Why Choose EP3SL340F1517C2N?

The EP3SL340F1517C2N positions itself as a high-density, memory-rich FPGA option for designers needing large programmable logic capacity, substantial embedded RAM, and wide I/O connectivity within a commercial temperature envelope. Its 1517-FBGA (40×40) surface-mount package and defined core voltage range make it suitable for compact, production-oriented electronic systems where integration and board space efficiency matter.

This device is well suited for teams and projects that require consolidated digital logic, on-chip buffering, and many external interfaces, enabling reduced component count and simplified board-level design while leveraging Intel’s Stratix® III L family characteristics.

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