EP3SL340F1517C3G

The EP3SL340F1517C3G is a Stratix III series FPGA offering high logic density and extensive on-chip memory for demanding digital, signal-processing, and system-integration applications. Built on the Stratix III architecture, this surface-mount FCBGA device targets high-performance embedded designs that require large fabric capacity, multiple clocking resources, and extensive I/O connectivity.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 976 user I/O pins, the device delivers the integration needed for complex logic, DSP, and high-speed memory interface implementations while operating within a commercial temperature range.

Key Features

• Logic Capacity — 337,500 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for FIFOs, buffers, and embedded storage.
• High I/O Count — 976 user I/O pins to support wide parallel interfaces and multiple modular I/O banks.
• Clocking and PLLs — Family-level support for up to 16 global clocks, 88 regional clocks, 116 peripheral clocks, and up to 12 PLLs for flexible clock distribution and synthesis.
• DSP and Multiplier Resources — High-speed DSP blocks with dedicated multipliers (9×9, 12×12, 18×18, 36×36) suitable for signal processing and multiply-accumulate functions.
• Memory Interface Support — Family features include dedicated support for DDR, DDR2, DDR3, RLDRAM II, QDR II, and QDR II+ memory interfaces on modular I/O banks.
• Signal Integrity — Dynamic on-chip termination (OCT), output delay and current strength control to aid high-speed I/O performance.
• Security and Reliability — Family support for 256-bit AES volatile and non-volatile configuration encryption, CRC for configuration memory error detection, and ECC for embedded memory blocks.
• Power and Voltage — Programmable Power Technology and selectable core voltage capability; device core supply range: 860 mV to 1.15 V.
• Package and Mounting — 1517-BBGA / 1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact board-level integration.
• Compliance and Grade — Commercial grade device with RoHS compliance; operating temperature range 0 °C to 85 °C.

Typical Applications

• High-performance DSP systems — Implement FIR filters, FFTs, and multiply-accumulate engines using the device’s dedicated DSP blocks and large logic fabric.
• Networking and communications — Build protocol engines and high-speed transceivers leveraging abundant I/O, dynamic on-chip termination, and clocking resources.
• Memory controller implementations — Support DDR-family and specialized SRAM interfaces using dedicated memory interface features and modular I/O banks.
• Embedded system integration — Integrate custom processors, peripheral logic, and security features (AES support) for advanced embedded designs.

Unique Advantages

• High integration density: 337,500 logic elements and large embedded RAM reduce the need for external components and simplify board-level design.
• Extensive I/O and clock resources: 976 user I/O pins and numerous global/regional/peripheral clocks provide flexibility for complex multi-interface systems.
• Dedicated DSP capabilities: Built-in multiplier blocks accelerate compute-intensive arithmetic tasks without consuming general logic resources.
• Configurable power and performance: Selectable core voltage and Programmable Power Technology allow tuning for performance or power efficiency within the specified supply range.
• Security and reliability features: AES configuration encryption, CRC for configuration memory, and ECC for embedded RAM enhance system robustness and protect intellectual property.
• Commercial-grade, RoHS-compliant packaging: 1517-FBGA (40×40) package and RoHS compliance facilitate mainstream product deployment within the 0 °C to 85 °C operating range.

Why Choose EP3SL340F1517C3G?

The EP3SL340F1517C3G positions itself as a high-capacity Stratix III FPGA suitable for designers who need a large logic fabric, significant on-chip memory, and a high I/O count in a single surface-mount package. Its family-level features—extensive clocking, DSP blocks, memory-interface support, and security/reliability circuitry—make it a fit for demanding embedded, signal-processing, and communications applications.

For teams building complex logic and memory subsystems, this device offers long-term design scalability and integration benefits through its combination of logic density, configurable power behavior, and embedded resources supported by the Stratix III device family tool and IP ecosystem.

Request a quote or submit a pricing inquiry to check availability and lead times for EP3SL340F1517C3G and evaluate how this Stratix III device can meet your project requirements.