EP3SL340F1517C4G

IC FPGA 976 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 347 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13500Number of Logic Elements/Cells337500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18822144

Overview of EP3SL340F1517C4G – Field Programmable Gate Array (FPGA) IC

The EP3SL340F1517C4G is a high-density Stratix III family FPGA from Intel, delivered in a 1517-ball FCBGA package for surface-mount systems. It targets high-performance logic, DSP and embedded applications that require large logic capacity, plentiful I/O and substantial on-chip memory.

Built on the Stratix III architecture, this device combines 337,500 logic elements with programmable power and selectable core voltage to balance performance and power efficiency for commercial-temperature applications.

Key Features

  • Logic Capacity  337,500 logic elements providing large-scale programmable logic resources for complex designs.
  • Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support buffering, FIFOs and memory-intensive algorithms.
  • High I/O Count  976 user I/O pins arranged to support wide parallel interfaces and multiple modular I/O banks.
  • Stratix III Architecture  Leverages family-level features such as Programmable Power Technology, selectable core voltage and high-speed DSP blocks as described in the Stratix III device handbook.
  • Clocking and PLLs  Family-level support includes multiple global and regional clocks and up to 12 PLLs for flexible clock generation and management.
  • Security and Reliability Options  Stratix III family devices include optional 256-bit AES configuration encryption and on-chip error detection/correction features for configuration and memory robustness.
  • Power and Supply  Core supply operation in the 0.860 V to 1.15 V range to support selectable performance/power tradeoffs.
  • Package and Mounting  1517-ball FBGA (40 × 40) package, surface-mount mounting suitable for compact, high-pin-count board designs.
  • Commercial Temperature Range  Rated for 0 °C to 85 °C operation (commercial grade).
  • RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

  • High-Performance DSP and Signal Processing  Large logic and embedded memory support FIR filters, multichannel processing and high-throughput DSP pipelines.
  • Networking and Communications  High I/O count and Stratix III family high-speed I/O features enable large parallel interfaces and modular I/O bank implementations for network PHYs and protocol processing.
  • Memory Interface Controllers  Substantial on-chip RAM combined with family-level memory interface support make this device suitable for custom memory controllers and buffering solutions.
  • Complex Embedded Systems  Ample logic, clocking resources and optional security features allow integration of controllers, accelerators and soft processors into a single device.

Unique Advantages

  • High Logic Density: 337,500 logic elements let you implement large, integrated designs and reduce the need for multiple devices.
  • Substantial On-Chip Memory: Approximately 18.8 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
  • Extensive I/O Capability: 976 user I/O pins enable wide parallel buses and flexible interfacing to peripherals and memory devices.
  • Configurable Power/Performance: Selectable core voltage operation and family Programmable Power Technology let designers tune performance versus power consumption.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and including family-level error detection and optional encryption features for improved system robustness and IP protection.
  • Compact High-Pin-Count Package: 1517-FBGA (40×40) packaging provides the pin density needed for feature-rich designs in a single, surface-mount footprint.

Why Choose EP3SL340F1517C4G?

The EP3SL340F1517C4G positions itself as a high-capacity, commercially rated Stratix III FPGA suitable for demanding logic, DSP and embedded integration tasks. With 337,500 logic elements, approximately 18.8 Mbits of embedded memory and 976 I/O, it supports large, consolidated designs where board-level simplification and on-chip integration are priorities.

Designed around the Stratix III family architecture, the device benefits from selectable core voltages, programmable power features, extensive clocking and PLL resources, and optional security and error-detection capabilities—providing a robust platform for scalable, performance-sensitive applications while leveraging Intel’s ecosystem of megafunctions and embedded processor support.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the EP3SL340F1517C4G.

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