EP3SL340F1517C4N

The EP3SL340F1517C4N is a Stratix® III L Field Programmable Gate Array (FPGA) manufactured by Intel, offering high logic density and extensive I/O in a compact FCBGA package. With 337,500 logic elements and approximately 18.8 Mbits of embedded memory, this device targets designs that require substantial on-chip logic and storage capacity while accommodating a large number of external interfaces.

Designed for commercial-temperature applications, the device operates from 0 °C to 85 °C and supports a core supply range of 860 mV to 1.15 V, making it suitable for board-level integration where logic density, memory capacity, and high I/O count are primary requirements.

Key Features

• Core Logic: 337,500 logic elements provide a high level of programmable logic capacity for complex digital designs and parallel processing tasks.
• Embedded Memory: Approximately 18.8 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive logic functions within the FPGA fabric.
• I/O Resources: 976 I/O pins to enable extensive peripheral connectivity and high-pin-count system interfaces.
• Power Supply Range: Core voltage supply from 860 mV to 1.15 V, allowing integration with a range of power architectures that meet the device’s specified supply window.
• Package & Mounting: 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mountable for compact PCB implementations.
• Operating Conditions: Commercial-grade operation from 0 °C to 85 °C for standard temperature-range applications.
• Compliance: RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing: Use the device’s large logic capacity for complex signal processing, protocol handling, and custom compute blocks that require many logic elements.
• I/O-intensive systems: Leverage 976 I/O pins for designs that need extensive external interfaces, multi-channel data acquisition, or large peripheral arrays.
• Embedded memory-dependent designs: Employ the approximately 18.8 Mbits of on-chip RAM for buffering, packet storage, and stateful logic without immediate external memory.
• Board-level integration: The 1517-BBGA FCBGA package supports compact PCB layouts where high density and surface-mount assembly are priorities.

Unique Advantages

• High logic density: 337,500 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM minimizes reliance on external memory for many applications, simplifying routing and BOM.
• Extensive I/O capacity: 976 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high-channel-count systems.
• Compact FCBGA footprint: The 1517-BBGA package delivers high-pin-count capability in a compact surface-mount form factor suitable for space-constrained designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C, appropriate for standard commercial-grade electronic products and applications.
• Environmentally compliant: RoHS compliance supports adherence to common environmental manufacturing standards.

Why Choose EP3SL340F1517C4N?

The EP3SL340F1517C4N balances significant on-chip resources—337,500 logic elements and approximately 18.8 Mbits of RAM—with a very high I/O count in a compact 1517-BBGA FCBGA package. It is well suited for designers who need to integrate dense logic, substantial embedded memory, and numerous external interfaces on a single FPGA for commercial-temperature applications.

Manufactured by Intel as part of the Stratix® III L family, this device provides a predictable platform for scaling complex digital designs where logic capacity, memory, and I/O are key selection criteria. A datasheet is available to support detailed design and integration.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL340F1517C4N.