EP3SL340F1517C4LG

IC FPGA 976 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,069 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13500Number of Logic Elements/Cells337500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18822144

Overview of EP3SL340F1517C4LG – Field Programmable Gate Array (FPGA) IC

The EP3SL340F1517C4LG is a high-density Stratix III family FPGA from Intel, delivering a large programmable fabric and substantial on-chip memory for complex logic, DSP and embedded designs. With a core voltage range of 0.86 V to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C, this surface-mount FCBGA device targets high-performance applications that require dense logic, significant embedded RAM and extensive I/O.

Key Features

  • Logic Capacity – Approximately 337,500 logic elements to implement complex, high-density designs.
  • Embedded Memory – Approximately 18.8 Mbits of on-chip RAM (18,822,144 bits) for large buffering, FIFOs and temporary storage.
  • I/O and Package – 976 user I/O pins in a 1517-BBGA / 1517-FBGA (40×40) FCBGA package; surface-mount construction for compact board integration.
  • Programmable Core Voltage – Core supply range 0.86 V to 1.15 V enabling selectable performance and power tradeoffs for system optimization.
  • High-Speed DSP and Arithmetic – Stratix III family DSP resources support wide multipliers and multiply-accumulate functions for signal processing workloads (family-level DSP capabilities documented in the device handbook).
  • Clocking and PLLs – Family features include multiple global, regional and peripheral clocks and up to 12 PLLs for flexible clock synthesis and distribution (family-level specifications apply).
  • High-Speed I/O Support – Family-level support for high-speed differential I/O, SERDES and dynamic on-chip termination for improved signal integrity in fast interfaces.
  • Security and Reliability – Stratix III family options include 256-bit AES configuration security, CRC for configuration memory and ECC protection for embedded memory blocks (family-level features).
  • Commercial Grade – Rated for operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • High-Performance Signal Processing – Deploy the device’s large logic capacity and family DSP resources for FIR filters, FFTs and real-time processing pipelines.
  • Networking and Communications – Use abundant I/O and high-speed differential interface support for protocol implementations, packet processing and line-rate interfacing.
  • Memory Interface Controllers – Combine on-chip RAM and flexible clocking/PLLs to implement DDR/DDR2/DDR3 memory controllers and buffering logic.
  • Embedded Systems and Accelerators – Leverage the large logic fabric and embedded memory to implement custom accelerators, offload engines and complex control systems.

Unique Advantages

  • High logic and memory density: Approximately 337,500 logic elements paired with ~18.8 Mbits of embedded RAM reduces dependence on external components and shortens data paths on-chip.
  • Flexible power/performance trade-offs: Selectable core voltage range (0.86 V–1.15 V) allows designers to tune device operation for performance or power savings.
  • Extensive I/O in a compact package: 976 user I/Os in a 1517-FBGA (40×40) footprint enables rich system connectivity while maintaining board-level density.
  • Family-level DSP and timing resources: Stratix III family DSP blocks, multiple clock domains and PLL resources provide the building blocks for demanding signal processing and timing-critical functions.
  • Security and data integrity: Family features such as 256-bit AES configuration options, CRC and ECC improve configuration and memory robustness for deployed systems.
  • Commercial-grade, RoHS compliant: Designed for commercial-temperature systems and compliant with RoHS environmental standards.

Why Choose EP3SL340F1517C4LG?

The EP3SL340F1517C4LG delivers a compelling combination of logic density, embedded memory and extensive I/O in a surface-mount FCBGA package, making it suitable for complex DSP, networking and embedded acceleration tasks within commercial-temperature environments. Its selectable core voltage and Stratix III family capabilities—such as rich DSP resources, configurable clocking and configuration security—offer designers the flexibility to balance performance, power and system integration.

Choose this device when your design requires large on-chip resources, high I/O counts and family-level features that support advanced signal processing and memory interfacing, while remaining within commercial operating conditions.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the EP3SL340F1517C4LG.

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