EP3SL340F1517C4LN

The EP3SL340F1517C4LN is a Stratix® III L field programmable gate array (FPGA) in a 1517-ball FCBGA package. It provides a high logic density architecture with a large embedded memory complement and extensive I/O, suitable for designs requiring significant on-chip logic and connectivity.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 976 user I/Os, this device targets high-density, I/O‑rich applications where integration and scalable logic resources are primary requirements. The device is supplied for commercial-grade environments and operates from 0 °C to 85 °C.

Key Features

• Core Logic Capacity  337,500 logic elements and 13,500 logic blocks provide substantial programmable resources for complex digital designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• High I/O Count  976 user I/Os enabling dense external interfacing and broad connectivity for multi-channel designs.
• Power Supply  Supports core voltage from 0.860 V to 1.15 V, allowing designers to plan power delivery around the device’s specified range.
• Package & Mounting  1517-BBGA FCBGA package (1517-FBGA, 40×40) with surface-mount mounting for compact board-level integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.

Typical Applications

• High-density digital systems  Implement complex custom logic and large combinational/sequential designs using the device’s extensive logic element count.
• Memory-intensive processing  Use the approximately 18.8 Mbits of embedded memory for data buffering, packet processing, and local storage.
• I/O-dense interfacing  Leverage 976 user I/Os for multi-channel connectivity, interface bridging, and system-level integration tasks.

Unique Advantages

• Substantial logic resources: 337,500 logic elements enable implementation of large-scale logic functions and parallel processing within a single device.
• Significant on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces reliance on external memory and simplifies board layout.
• Extensive I/O integration: 976 I/Os support dense external connectivity and flexible interfacing options for complex system designs.
• Compact package footprint: The 1517-ball FCBGA (40×40) package offers high pin count in a space-efficient surface-mount form factor.
• Commercial temperature suitability: Rated 0 °C to 85 °C to align with standard commercial deployment scenarios.

Why Choose EP3SL340F1517C4LN?

The EP3SL340F1517C4LN delivers a combination of high logic density, substantial embedded memory, and nearly one thousand user I/Os in a compact FCBGA package. This balance of resources is well suited to designers who need to consolidate complex digital functions and extensive interfacing into a single FPGA device.

Ideal for teams developing high‑density, I/O‑rich solutions where on‑chip memory and logic capacity reduce BOM complexity and board-level routing. The commercial temperature grade and clearly specified supply range support dependable integration into standard production designs.

Request a quote or submit a pricing inquiry today to discuss availability, lead times, and how EP3SL340F1517C4LN can meet your project requirements.