EP3SL340F1517C4L

The EP3SL340F1517C4L is a Stratix® III L field programmable gate array (FPGA) offered in a 1517-BBGA FCBGA package. It provides large on-chip resources and a high I/O count for designs that require extensive logic capacity and connectivity.

This commercial-grade, surface-mount device is targeted at applications that benefit from substantial embedded memory, high logic element counts, and broad I/O availability within a compact 1517-FBGA (40×40) footprint.

Key Features

• Core Logic  Approximately 337,500 logic elements organized across 13,500 CLBs to support complex logic implementations.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM for buffering, data storage, and embedded memory functions.
• I/O Density  976 I/O pins to enable broad external connectivity and multi-channel interfacing.
• Package and Mounting  1517-BBGA (FCBGA) / 1517-FBGA (40×40) package; surface-mount mounting type for board-level integration.
• Power  Core voltage supply range of 860 mV to 1.15 V to match system power domains.
• Temperature and Grade  Commercial grade operation from 0°C to 85°C for standard environment deployments.
• Environmental Compliance  RoHS compliant for regulatory and assembly considerations.

Typical Applications

• High-density logic implementations  Use the large logic-element count and CLB array to map complex state machines, data paths, or custom processing blocks.
• On-chip buffering and data handling  Leverage approximately 18.8 Mbits of embedded RAM for packet buffering, FIFOs, and local storage to reduce external memory dependence.
• Multi-channel I/O designs  976 I/O pins support systems that require numerous parallel interfaces, sensor arrays, or multi-protocol glue logic.

Unique Advantages

• High logic capacity: The device’s approximately 337,500 logic elements enable consolidation of large functions into a single FPGA, reducing system complexity.
• Substantial embedded memory: Approximately 18.8 Mbits of on-chip RAM allows significant on-die data buffering and storage, improving throughput and latency for many designs.
• Extensive I/O connectivity: 976 I/O pins provide flexibility for integrating multiple interfaces and peripherals without extensive external multiplexing.
• Compact, board-ready package: The 1517-BBGA / 1517-FBGA (40×40) FCBGA package with surface-mount mounting supports dense PCB layouts and scalable system integration.
• Power-domain compatibility: The 860 mV to 1.15 V supply range accommodates common core-voltage architectures for efficient power planning.
• RoHS compliance: Supports environmentally compliant assembly and manufacturing processes.

Why Choose EP3SL340F1517C4L?

The EP3SL340F1517C4L positions itself as a high-capacity Stratix® III L FPGA solution for designs that need abundant logic resources, significant embedded RAM, and a high number of I/O signals in a compact FCBGA package. Its commercial temperature range and RoHS compliance make it suitable for standard-environment electronics that prioritize integration and board-level density.

Designers and procurement teams seeking a device capable of consolidating complex logic, reducing external memory needs, and providing broad connectivity will find the EP3SL340F1517C4L a pragmatic choice for scalable prototypes and production systems where the specified electrical, thermal, and package parameters align with project requirements.

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