EP3SL340F1517I3

The EP3SL340F1517I3 is a Stratix® III L field programmable gate array (FPGA) designed for industrial-grade programmable logic applications. It combines a high logic capacity with extensive I/O and substantial on-chip memory to support complex, I/O‑dense designs.

Key architectural and system attributes include 337,500 logic elements, approximately 18.8 Mbits of embedded memory, 976 I/O pins, a 1517‑FBGA surface‑mount package, an operating voltage range of 860 mV to 1.15 V, and an industrial operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic Capacity 337,500 logic elements provide the programmable fabric for implementing complex custom logic, state machines, and parallel processing blocks.
• Embedded Memory Approximately 18.8 Mbits of on‑chip RAM to support buffering, FIFOs, and data‑path storage without external memory dependence.
• High I/O Count 976 user I/O pins to connect to a wide range of peripherals, interfaces, and board-level signals for I/O‑intensive applications.
• Power Supply Range Operates from 860 mV to 1.15 V, enabling compatibility with common system power rails used for FPGA core supply.
• Industrial Temperature Rating Specified for operation from -40 °C to 100 °C for reliable performance in demanding environmental conditions.
• Package and Mounting 1517‑BBGA (FCBGA) surface‑mount package, supplier device package listed as 1517‑FBGA (40×40), suitable for compact board integration.
• Manufacturer Produced by Intel, providing a recognized source for FPGA silicon.
• RoHS Compliance RoHS‑compliant design for adherence to common environmental requirements.

Typical Applications

• Industrial Control Systems — Implement custom control logic, sensor interfacing, and real‑time processing within industrial equipment that requires an industrial temperature range.
• I/O‑Intensive Data Aggregation — Use the large I/O count and on‑chip memory for aggregating and buffering multiple high‑fan‑out signals or peripheral interfaces.
• Embedded Processing and Custom Acceleration — Deploy as a hardware acceleration element or programmable datapath where large logic capacity and embedded RAM are needed.

Unique Advantages

• High Logic Density: 337,500 logic elements enable implementation of large-scale custom logic and multi‑function designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 18.8 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and lowering latency for data buffering.
• Extensive I/O Resources: 976 I/O pins provide flexibility to support numerous interfaces and board‑level connectivity in a single device.
• Industrial Reliability: Rated for -40 °C to 100 °C operation to meet the environmental demands of industrial applications.
• Compact Surface‑Mount Package: 1517‑FBGA (40×40) package supports dense PCB layouts while delivering the device’s high integration.
• Controlled Core Voltage Range: 860 mV to 1.15 V core supply range aligns with common FPGA supply schemes for predictable power design.

Why Choose EP3SL340F1517I3?

The EP3SL340F1517I3 positions itself as a high‑capacity, industrial‑rated FPGA option for designs demanding large programmable logic, significant embedded memory, and broad I/O connectivity in a compact surface‑mount package. Its specifications make it suitable for engineers building industrial control, data aggregation, or embedded acceleration systems that require robust operation across a wide temperature range.

Backed by Intel manufacturing, this device offers a combination of capacity, integration, and environmental tolerance that supports scalable designs and long‑term deployment in industrial environments.

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