EP3SL340F1517I4L

The EP3SL340F1517I4L is a high-density Stratix® III L field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. Built for industrial applications, it provides a combination of large logic capacity, significant on-chip memory, and a high I/O count for complex system integration.

Engineered for designs that require substantial programmable logic and embedded RAM, this device suits board- and system-level designs where integration, scalability, and extended temperature operation are important considerations.

Key Features

• Logic Capacity — 337,500 logic elements provide extensive programmable resources for complex logic, datapath and control implementations.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM support large buffering, state storage, and memory-intensive processing functions.
• I/O Density — 976 I/O pins enable high connectivity for multi-channel interfaces and dense board-level integration.
• Power Supply Range — Operates from 860 mV to 1.15 V, allowing designs that target the device’s specified core voltage window.
• Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA surface-mount package for compact, board-level deployment.
• Industrial Temperature Range — Rated for −40 °C to 100 °C, suitable for industrial environments requiring extended ambient operation.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement real-time control logic, motor control interfaces, and multi-sensor aggregation with abundant logic and I/O resources.
• High-density Signal Processing — Use the large logic array and on-chip RAM for buffering and parallel processing in DSP and data-path applications.
• System Integration and Interface Bridging — Consolidate multiple interfaces and protocol bridges on a single device thanks to the high pin count and logic capacity.
• Embedded Prototyping and Development — Ideal for validating complex designs that require significant programmable resources and memory on a compact board footprint.

Unique Advantages

• High logic density: 337,500 logic elements enable integration of large FPGA designs without partitioning across multiple devices.
• Significant embedded memory: Approximately 18.8 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O capacity: 976 I/O pins provide flexibility to connect numerous peripherals, transceivers, and sensors directly to the FPGA.
• Industrial-grade operation: Rated from −40 °C to 100 °C and specified as Industrial grade for use in harsher ambient conditions.
• Compact FCBGA package: 1517-BBGA (40×40) delivers a dense footprint for high-performance boards while supporting surface-mount assembly.
• RoHS compliant: Conforms to lead-free materials requirements for environmentally conscious designs.

Why Choose EP3SL340F1517I4L?

The EP3SL340F1517I4L positions itself for designs that demand substantial programmable logic, large embedded memory, and broad I/O connectivity within an industrial temperature window. Its combination of resources makes it suitable for consolidating functions that would otherwise require multiple components, simplifying BOM and board layout.

This device is appropriate for engineering teams and procurement seeking a high-density FPGA solution for industrial and embedded projects that require scalability, on-chip memory capacity, and a compact BGA package.

If you would like pricing, availability, or to request a formal quote for EP3SL340F1517I4L, please submit a request and our sales team will respond with current lead time and ordering details.