EP3SL340F1517I4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 706 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13500 | Number of Logic Elements/Cells | 337500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 18822144 |
Overview of EP3SL340F1517I4LG – Field Programmable Gate Array (FPGA) IC
The EP3SL340F1517I4LG is an Intel Stratix III family FPGA offering high logic density and extensive on-chip resources for complex digital, DSP and embedded designs. Built on the Stratix III architecture, it targets applications that require large amounts of logic, embedded memory and flexible I/O in an industrial-grade, surface-mount package.
This device combines approximately 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 976 user I/Os with a 1517-FBGA package and a core voltage range of 0.86–1.15 V, enabling scalable implementations of high-performance logic, memory interfaces and signal-processing functions.
Key Features
- Logic Density Approximately 337,500 logic elements to implement large-scale logic and control functions.
- On-chip Memory Approximately 18.8 Mbits of embedded TriMatrix-style memory for FIFOs, dual-port RAM and data buffering.
- DSP and Arithmetic Support Family architecture includes high-speed DSP block support for multiply and multiply-accumulate functions suitable for signal processing workloads.
- I/O and Packaging 976 user I/Os in a modular I/O bank architecture, supplied in a 1517-BBGA / 1517-FBGA (40×40) surface-mount package for dense board-level integration.
- Clocking and PLLs Family-level support for multiple global and regional clocks and up to 12 phase-locked loops (PLLs) for flexible clock management and synthesis.
- Core Voltage Operates with a core supply range of 0.86 V to 1.15 V to match system power requirements.
- Industrial Temperature Rated for operation from −40 °C to 100 °C for industrial deployment.
- Security and Reliability Stratix III family features include optional 256-bit AES configuration key support and on-chip error detection/correction mechanisms.
- Standards and Compliance RoHS compliant and provided in a surface-mount FBGA package for standard manufacturing flows.
Typical Applications
- High‑Performance DSP Implement real-time filtering, FFTs and multichannel signal processing using the device’s DSP resources and large embedded memory.
- Networking & Communications Support high-speed interfaces and protocol processing with extensive I/O and programmable SERDES/clocking capabilities provided by the Stratix III family.
- Memory Interface Controllers Use the device’s abundant logic and dedicated memory support to implement DDR/DDR2/DDR3 and other external-memory controllers and bridge functions.
- Embedded Systems & Acceleration Deploy custom accelerators and embedded logic for compute-intensive tasks where deterministic hardware performance and flexibility are required.
Unique Advantages
- High integration density: The large count of logic elements and embedded memory reduces the need for multiple discrete components and simplifies board-level architecture.
- Flexible I/O and packaging: 976 user I/Os in a 1517-FBGA package support dense external connectivity while preserving a compact PCB footprint.
- Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in demanding environments.
- Configurable power envelope: A core supply range of 0.86–1.15 V enables designers to match performance and power for system requirements.
- Clocking and DSP support: Multi-clock architecture and dedicated DSP features enable precise timing control and efficient implementation of arithmetic-heavy functions.
- Ecosystem support: Stratix III family features include embedded processor and IP megafunction support, aiding rapid integration of common subsystems.
Why Choose EP3SL340F1517I4LG?
The EP3SL340F1517I4LG positions itself as a high-density, industrial-grade FPGA suited for applications that demand significant logic resources, embedded memory and flexible I/O in a single, surface-mount package. Its combination of approximately 337,500 logic elements, roughly 18.8 Mbits of on-chip memory, broad clocking resources and industrial temperature rating make it appropriate for complex DSP, networking and embedded-acceleration designs.
Backed by the Stratix III family architecture and associated IP ecosystem, this device offers a path for scalable system designs where performance, integration and long-term availability are important considerations.
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