EP3SL340F1517I4LG

IC FPGA 976 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 706 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13500Number of Logic Elements/Cells337500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18822144

Overview of EP3SL340F1517I4LG – Field Programmable Gate Array (FPGA) IC

The EP3SL340F1517I4LG is an Intel Stratix III family FPGA offering high logic density and extensive on-chip resources for complex digital, DSP and embedded designs. Built on the Stratix III architecture, it targets applications that require large amounts of logic, embedded memory and flexible I/O in an industrial-grade, surface-mount package.

This device combines approximately 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 976 user I/Os with a 1517-FBGA package and a core voltage range of 0.86–1.15 V, enabling scalable implementations of high-performance logic, memory interfaces and signal-processing functions.

Key Features

  • Logic Density  Approximately 337,500 logic elements to implement large-scale logic and control functions.
  • On-chip Memory  Approximately 18.8 Mbits of embedded TriMatrix-style memory for FIFOs, dual-port RAM and data buffering.
  • DSP and Arithmetic Support  Family architecture includes high-speed DSP block support for multiply and multiply-accumulate functions suitable for signal processing workloads.
  • I/O and Packaging  976 user I/Os in a modular I/O bank architecture, supplied in a 1517-BBGA / 1517-FBGA (40×40) surface-mount package for dense board-level integration.
  • Clocking and PLLs  Family-level support for multiple global and regional clocks and up to 12 phase-locked loops (PLLs) for flexible clock management and synthesis.
  • Core Voltage  Operates with a core supply range of 0.86 V to 1.15 V to match system power requirements.
  • Industrial Temperature  Rated for operation from −40 °C to 100 °C for industrial deployment.
  • Security and Reliability  Stratix III family features include optional 256-bit AES configuration key support and on-chip error detection/correction mechanisms.
  • Standards and Compliance  RoHS compliant and provided in a surface-mount FBGA package for standard manufacturing flows.

Typical Applications

  • High‑Performance DSP  Implement real-time filtering, FFTs and multichannel signal processing using the device’s DSP resources and large embedded memory.
  • Networking & Communications  Support high-speed interfaces and protocol processing with extensive I/O and programmable SERDES/clocking capabilities provided by the Stratix III family.
  • Memory Interface Controllers  Use the device’s abundant logic and dedicated memory support to implement DDR/DDR2/DDR3 and other external-memory controllers and bridge functions.
  • Embedded Systems & Acceleration  Deploy custom accelerators and embedded logic for compute-intensive tasks where deterministic hardware performance and flexibility are required.

Unique Advantages

  • High integration density: The large count of logic elements and embedded memory reduces the need for multiple discrete components and simplifies board-level architecture.
  • Flexible I/O and packaging: 976 user I/Os in a 1517-FBGA package support dense external connectivity while preserving a compact PCB footprint.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in demanding environments.
  • Configurable power envelope: A core supply range of 0.86–1.15 V enables designers to match performance and power for system requirements.
  • Clocking and DSP support: Multi-clock architecture and dedicated DSP features enable precise timing control and efficient implementation of arithmetic-heavy functions.
  • Ecosystem support: Stratix III family features include embedded processor and IP megafunction support, aiding rapid integration of common subsystems.

Why Choose EP3SL340F1517I4LG?

The EP3SL340F1517I4LG positions itself as a high-density, industrial-grade FPGA suited for applications that demand significant logic resources, embedded memory and flexible I/O in a single, surface-mount package. Its combination of approximately 337,500 logic elements, roughly 18.8 Mbits of on-chip memory, broad clocking resources and industrial temperature rating make it appropriate for complex DSP, networking and embedded-acceleration designs.

Backed by the Stratix III family architecture and associated IP ecosystem, this device offers a path for scalable system designs where performance, integration and long-term availability are important considerations.

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