EP3SL340F1517I4

The EP3SL340F1517I4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for high-density, reconfigurable logic applications. It combines a large logic element count with substantial embedded memory and a high I/O pin count to address demanding digital designs.

This device targets applications that require significant on-chip resources and robust industrial operating conditions, offering a balance of integration, I/O capacity and thermal tolerance to support deployment in industrial environments.

Key Features

• Core Architecture  Stratix® III L FPGA architecture delivered in a high-density fabric suitable for complex logic implementations.
• Logic Capacity  Contains 337,500 logic elements and 13,500 CLB-style logic blocks for implementing large-scale custom logic and datapaths.
• Embedded Memory  Provides approximately 18.8 Mbits of on-chip RAM to support FIFOs, buffers and local data storage without external memory.
• I/O Density  Offers 976 user I/O pins to support wide parallel buses, multiple interfaces and complex board-level interconnects.
• Power Supply  Core voltage range specified from 860 mV to 1.15 V, enabling compatibility with standard FPGA power architectures.
• Package & Mounting  Supplied in a 1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40) for surface-mount assembly and compact board placement.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for factory and industrial installations.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-density digital signal processing  Large logic capacity and on-chip RAM enable implementation of wide datapaths and buffering for DSP pipelines.
• Network and communication systems  High I/O count supports multiple parallel interfaces and custom protocol engines on a single device.
• Industrial control and automation  Industrial temperature rating and robust I/O make the device suitable for control logic, motor drives and sensor aggregation.
• Reconfigurable computing modules  Substantial logic resources and embedded memory facilitate custom accelerator and FPGA-based prototyping boards.

Unique Advantages

• High logic density: 337,500 logic elements provide the capacity to integrate large, complex designs without external logic expansion.
• Significant on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level BOM.
• Extensive I/O availability: 976 user I/Os enable broad interface support and flexible partitioning of signals across the FPGA.
• Industrial robustness: Rated for −40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
• Compact BGA package: 1517-BBGA FCBGA (1517-FBGA 40×40) package provides a dense footprint for space-constrained designs while supporting surface-mount assembly.
• RoHS compliance: Meets environmental directives for lead-free manufacturing and assembly.

Why Choose EP3SL340F1517I4?

The EP3SL340F1517I4 positions itself as a high-capacity, industrial-grade Stratix® III L FPGA that brings together extensive logic resources, large embedded memory and very high I/O density. This combination makes it well suited for engineers who need to consolidate complex digital functions into a single programmable device while maintaining industrial operating tolerances.

Choose this device when your design demands substantial on-chip resources, broad interface support and a compact BGA form factor—providing scalability and integration that help reduce board-level complexity and BOM count.

Request a quote or submit a pricing inquiry to begin evaluating EP3SL340F1517I4 for your next design.