EP3SL340F1517I3N

The EP3SL340F1517I3N is a Stratix® III L series FPGA from Intel, supplied in a 1517-BBGA (FCBGA) package. It delivers a large logic fabric, extensive I/O, and substantial on-chip memory tailored for industrial-grade designs.

Key hardware characteristics include 337,500 logic elements, 976 I/O pins, and approximately 18.8 Mbits of embedded memory, with an operating temperature range of -40 °C to 100 °C and a core supply range of 860 mV to 1.15 V.

Key Features

• Core Logic  337,500 logic elements provide a high-density programmable fabric for complex digital designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support memory-intensive functions and buffering.
• High I/O Count  976 general-purpose I/O pins enable extensive interfacing with external devices and systems.
• Package and Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
• Power  Core voltage supply range from 860 mV to 1.15 V to match system power rails and platform requirements.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet industrial environmental demands.
• Standards Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.
• Logic Block Resources  13,500 CLBs (configurable logic blocks) to structure and partition complex logic implementations.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and a high I/O count make this FPGA suitable for control systems, PLCs, and factory automation interfaces.
• High-Density Logic Implementations  Large logic element count supports consolidated digital designs that replace multiple discrete components.
• Memory-Intensive Functions  On-chip embedded memory capacity enables buffering, packet processing, and other tasks that require substantial internal RAM.
• Complex I/O and Interface Bridging  Extensive I/O resources support boards and systems that require many parallel and serial connections to external peripherals.

Unique Advantages

• High Integration Density: 337,500 logic elements and 13,500 CLBs allow designers to implement large, complex functions on a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 18.8 Mbits of embedded RAM helps minimize external memory requirements and simplifies timing and board layout.
• Exceptional I/O Capacity: 976 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and high-pin-count peripheral support.
• Industrial Reliability: Rated for -40 °C to 100 °C operation and RoHS compliant, supporting deployments in demanding environments with regulatory compliance.
• Flexible Power Envelope: Core supply range of 860 mV to 1.15 V accommodates a variety of power architectures and helps with system-level power planning.
• Surface-Mount Packaging: 1517-BBGA (40×40) FCBGA package enables compact board layouts and standard surface-mount assembly processes.

Why Choose EP3SL340F1517I3N?

The EP3SL340F1517I3N positions itself as a high-density, industrial-grade FPGA option within the Stratix® III L family, combining large logic capacity, significant embedded memory, and a high I/O count for demanding designs. Its operating range and RoHS compliance make it suitable for long-life industrial applications where environmental tolerance and regulatory alignment matter.

This device is ideal for engineering teams seeking to consolidate complex digital logic, support memory-heavy functions on-chip, and interface with many peripherals while maintaining a compact surface-mount package footprint.

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